Control of bonding and epitaxy at copper/sapphire interface

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

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Control of bonding and epitaxy at copper/sapphire interface. / Oh, S.H.; Scheu, Christina; Wagner, T. et al.
in: Applied physics letters, Jahrgang 91, 2007, S. 141912-1-141912-3.

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

Vancouver

Oh SH, Scheu C, Wagner T, Rühle M. Control of bonding and epitaxy at copper/sapphire interface. Applied physics letters. 2007;91:141912-1-141912-3. doi: 10.1063/1.2794025

Author

Oh, S.H. ; Scheu, Christina ; Wagner, T. et al. / Control of bonding and epitaxy at copper/sapphire interface. in: Applied physics letters. 2007 ; Jahrgang 91. S. 141912-1-141912-3.

Bibtex - Download

@article{6f7c47b1081a4b8a90324c232c8e8349,
title = "Control of bonding and epitaxy at copper/sapphire interface",
author = "S.H. Oh and Christina Scheu and T. Wagner and M. R{\"u}hle",
year = "2007",
doi = "10.1063/1.2794025",
language = "English",
volume = "91",
pages = "141912--1--141912--3",
journal = "Applied physics letters",
issn = "0003-6951",
publisher = "American Institute of Physics Publising LLC",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Control of bonding and epitaxy at copper/sapphire interface

AU - Oh, S.H.

AU - Scheu, Christina

AU - Wagner, T.

AU - Rühle, M.

PY - 2007

Y1 - 2007

U2 - 10.1063/1.2794025

DO - 10.1063/1.2794025

M3 - Article

VL - 91

SP - 141912-1-141912-3

JO - Applied physics letters

JF - Applied physics letters

SN - 0003-6951

ER -