20 kHz X-ray diffraction on Cu thin films explores thermomechanical fatigue at high strain-rates

Research output: Contribution to journal › Article › Research › peer-review

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20 kHz X-ray diffraction on Cu thin films explores thermomechanical fatigue at high strain-rates. / Ziegelwanger, T.; Reisinger, M.; Vedad, B. et al.
In: Materials and Design, Vol. 251, 113664, 03.2025.

Research output: Contribution to journal › Article › Research › peer-review

Harvard

Ziegelwanger, T, Reisinger, M, Vedad, B, Hlushko, K, Petegem, SV, Todt, J, Meindlhumer, M & Keckes, J 2025, '20 kHz X-ray diffraction on Cu thin films explores thermomechanical fatigue at high strain-rates', Materials and Design, vol. 251, 113664. https://doi.org/10.1016/j.matdes.2025.113664

APA

Ziegelwanger, T., Reisinger, M., Vedad, B., Hlushko, K., Petegem, S. V., Todt, J., Meindlhumer, M., & Keckes, J. (2025). 20 kHz X-ray diffraction on Cu thin films explores thermomechanical fatigue at high strain-rates. Materials and Design, 251, Article 113664. https://doi.org/10.1016/j.matdes.2025.113664

Vancouver

Ziegelwanger T, Reisinger M, Vedad B, Hlushko K, Petegem SV, Todt J et al. 20 kHz X-ray diffraction on Cu thin films explores thermomechanical fatigue at high strain-rates. Materials and Design. 2025 Mar;251:113664. doi: 10.1016/j.matdes.2025.113664

Author

Ziegelwanger, T. ; Reisinger, M. ; Vedad, B. et al. / 20 kHz X-ray diffraction on Cu thin films explores thermomechanical fatigue at high strain-rates. In: Materials and Design. 2025 ; Vol. 251.

Bibtex - Download

@article{6049f6afeb7c4cb985e8f9f0d1669058,
title = "20 kHz X-ray diffraction on Cu thin films explores thermomechanical fatigue at high strain-rates",
keywords = "Cu Thin Film, High Strain-Rate, Microelectronics, Residual Stresses, Synchrotron X-ray Diffraction, Thermomechanical Fatigue",
author = "T. Ziegelwanger and M. Reisinger and B. Vedad and K. Hlushko and Petegem, {S. Van} and J. Todt and M. Meindlhumer and J. Keckes",
note = "Publisher Copyright: {\textcopyright} 2025 The Author(s)",
year = "2025",
month = mar,
doi = "10.1016/j.matdes.2025.113664",
language = "English",
volume = "251",
journal = "Materials and Design",
issn = "0264-1275",
publisher = "Elsevier",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - 20 kHz X-ray diffraction on Cu thin films explores thermomechanical fatigue at high strain-rates

AU - Ziegelwanger, T.

AU - Reisinger, M.

AU - Vedad, B.

AU - Hlushko, K.

AU - Petegem, S. Van

AU - Todt, J.

AU - Meindlhumer, M.

AU - Keckes, J.

N1 - Publisher Copyright: © 2025 The Author(s)

PY - 2025/3

Y1 - 2025/3

KW - Cu Thin Film

KW - High Strain-Rate

KW - Microelectronics

KW - Residual Stresses

KW - Synchrotron X-ray Diffraction

KW - Thermomechanical Fatigue

UR - http://www.scopus.com/inward/record.url?scp=85216652400&partnerID=8YFLogxK

U2 - 10.1016/j.matdes.2025.113664

DO - 10.1016/j.matdes.2025.113664

M3 - Article

AN - SCOPUS:85216652400

VL - 251

JO - Materials and Design

JF - Materials and Design

SN - 0264-1275

M1 - 113664

ER -

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