Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages during the Assembly Process
Prize: Prize (including medals and awards)
Katerina Macurova (Recipient)
Outstanding Student Paper Award IMAPS 2014
| Awarded date | 14 Oct 2014 |
|---|---|
| Awarded at event | 47th International Symposium on Microelectronics: Future of Packaging, IMAPS 2014 |
