Thomas Antretter
Research output
- 2015
- Published
An inverse finite element approach to calculate full-field forming strains
Ritt, R., Machado, M., Fischlschweiger, M., Major, Z. & Antretter, T., Jul 2015, Key engineering materials. Vol. 651-653.2015. p. 363-368 6 p. (Key engineering materials).Research output: Chapter in Book/Report/Conference proceeding › Chapter › Research
- Published
The relation of temperature, microwave absorbing properties and thermo - dynamic behavior of selected hard rocks
Hartlieb, P., Toifl, M., Meisels, R., Antretter, T. & Kuchar, F., 11 Jun 2015, Physical Separation 15 - Proceedings.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
The relation of temperature, microwave absorbing properties and thermo-dynamic properties of selected hard rocks
Hartlieb, P., Toifl, M., Meisels, R., Antretter, T. & Kuchar, F., 11 Jun 2015.Research output: Contribution to conference › Presentation › Research
- Published
NUMERICAL ANALYSIS OF THE ROCK CUTTING PROCESS BASED ON A TWO PARAMETER DESCRIPTION OF TENSILE STRENGTH USING THE WEIBULL THEORY
Mikl-Resch, M. J., Tichy, R., Antretter, T., Pittino, G., Galler, R., Ecker, W., Gimpel, M. & Kargl, H., 13 May 2015. 5 p.Research output: Contribution to conference › Presentation › Research › peer-review
- Published
NUMERICAL ANALYSIS OF THE ROCK CUTTING PROCESS BASED ON A TWO PARAMETER DESCRIPTION OF TENSILE STRENGTH USING THE WEIBULL THEORY
Mikl-Resch, M. J., Antretter, T., Tichy, R., Pittino, G., Galler, R., Ecker, W., Gimpel, M. & Kargl, H., 10 May 2015, ISRM 2015_PROCEEDINGS. 5 p. 724Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
NUMERICAL ANALYSIS OF THE ROCK CUTTING PROCESS BASED ON A TWO PARAMETER DESCRIPTION OF TENSILE STRENGTH USING THE WEIBULL THEORY
Mikl-Resch, M. J., Antretter, T., Tichy, R., Pittino, G., Galler, R., Ecker, W., Gimpel, M. & Kargl, H., 10 May 2015. 5 p.Research output: Contribution to conference › Poster › Research
- Published
Fracture mechanics of thin film systems on the sub-micron scale
Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T. & Ganser, H. P., 6 May 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 7103088Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process
Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Apr 2015, In: Journal of Microelectronics and Electronic Packaging. 12.2015, 2, p. 80-85 6 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
3D numerical study on microwave induced stresses in inhomogeneous hard rocks
Toifl, M., Meisels, R., Hartlieb, P., Kuchar, F. & Antretter, T., 2015.Research output: Contribution to conference › Presentation › Research
- Published
3D numerical study on microwave induced stresses in inhomogeneous hard rocks
Toifl, M., Meisels, R., Hartlieb, P., Kuchar, F. & Antretter, T., 2015.Research output: Contribution to conference › Paper
