Thomas Antretter
191 - 200 out of 236Page size: 10
Research output
- Published
An inverse finite element approach to calculate full-field forming strains
Ritt, R., Machado, M., Fischlschweiger, M., Major, Z. & Antretter, T., Jul 2015, Key engineering materials. Vol. 651-653.2015. p. 363-368 6 p. (Key engineering materials).Research output: Chapter in Book/Report/Conference proceeding › Chapter › Research
- Published
Modelling of phase transformations and residual stress formation in hot-work tool steel components
Schemmel, M., Prevedel, P., Schöngrundner, R., Ecker, W. & Antretter, T., 2014, European Conference of Heat Treatment and 21st IFHTSE Congress. p. 285-292Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Prediction and Characterization of Residual Stresses after Heat Treatment of Massive Hot Work Tool Steel Components
Schemmel, M., Antretter, T., Ecker, W. & Prevedel, P., 19 Apr 2017.Research output: Contribution to conference › Presentation › Research › peer-review
- Published
Size effects in residual stress formation during quenching of cylinders made of hot-work tool steel
Schemmel, M., Prevedel, P., Schöngrundner, R., Ecker, W. & Antretter, T., 2015, In: Advances in Materials Science and Engineering. 7 p., 678056.Research output: Contribution to journal › Article › Research › peer-review
- Published
Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., Dec 2022, In: Microelectronics Reliability. 139.2022, December, 9 p., 114799.Research output: Contribution to journal › Article › Research › peer-review
- Published
Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method
Schöngrundner, R., Treml, R., Antretter, T., Kozic, D., Ecker, W. & Kiener, D., 2014, In: Thin solid films. p. 321-330Research output: Contribution to journal › Article › Research › peer-review
- Published
Simulation of the mechanical response of the individual intermetallic phases in multi-phase γ titanium aluminides
Seligmann, B., Spörk-Erdely, P. & Antretter, T., 2023.Research output: Contribution to conference › Poster › Research
- Published
Finite Element Investigation of the Dynamic Behavior of High-Speed Turnouts with Swing-Nose Crossing
Sistaninia, M., Daves, W., Bucher, C., Antretter, T. & Gänser, H. P., 2025, Advances in Dynamics of Vehicles on Roads and Tracks III - Proceedings of the 28th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2023, Rail Vehicles. Huang, W. & Ahmadian, M. (eds.). p. 1047-1058 12 p. (Lecture Notes in Mechanical Engineering).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Effect of back stress evolution due to martensitic transformation on iso-volume fraction lines in a Cr-Ni-Mo-Al-Ti maraging steel
Tanaka, K., Terasaki, T., Goto, S., Antretter, T., Fischer, F. D. & Cailletaud, G., 20 Jan 2003, In: Materials science and engineering: A, Structural materials: properties, microstructure and processing. 341, 1-2, p. 189-196 8 p.Research output: Contribution to journal › Article › Research › peer-review
