Michael Feuchter

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Research output

  1. Published

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  2. Published

    Polymers characterized using in-situ laboratory saxs/waxs coupled with mechanical tests

    Feuchter, M., Keckes, J. & Maier, G. A., 2011.

    Research output: Contribution to conference › Poster › Research › peer-review

  3. Published

    Physikalische Prüfungen von Elastomer-Mischungen

    Feuchter, M. & Pinter, G., 2011

    Research output: Book/Report › Commissioned report › Transfer › peer-review

  4. Published

    Optimization of the Long Term Performance of Pipes by Multilayer Build Ups

    Arbeiter, F., Sevcik, M., Hutař, P., Feuchter, M., Bruckmoser, K. & Pinter, G., 22 Sept 2015.

    Research output: Contribution to conference › Presentation › Research

  5. Published

    Optimization of the Long Term Performance of Pipes by Multilayer Build Ups

    Arbeiter, F., Ševčík, M., Hutař, P., Feuchter, M., Bruckmoser, K. & Pinter, G., 23 Sept 2015, PPS 2015 - Book of Abstracts. p. 134

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  6. Published

    Optimization of Compatibilizer Admixture in Polypropylene-Organclay Nanocomposites by Extensional Rheology

    Kracalik, M., Laske, S., Feuchter, M., Maier, G., Pinter, G., Friesenbichler, W. & Langecker, G., 2008, ASPM 2008 - 9th Austrian Polymer Meeting - Book of Abstracts. p. 43-43

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  7. Published

    Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

    Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  8. Published

    Nano vs. recycling: a study of different fillers for thermosets

    Feuchter, M., Kern, W. & Sieberer, M., Jul 2022, EPF European Polymer Congress - Book of Abstracts. 1 ed. Prag, p. 272

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  9. Published

    Nano vs. recycling: a study of different fillers for thermosets

    Feuchter, M., Sieberer, M. & Kern, W., Jun 2022.

    Research output: Contribution to conference › Poster › Research

  10. Published

    Nanostructured Carbon Fibre-Reinforced Polymer for Tailored Visual Appearance

    Lenzenweger, R., Feuchter, M., Pinter, G. G., Gruber, D. P., McNamara, D. & Brunner, A. J., 26 Nov 2018.

    Research output: Contribution to conference › Poster › Research

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