Michael Burtscher
Activities
Fracture of distinct interfaces: In-situ observations vs. stiffness approaches
Kiener, D. (Invited speaker), Wurmshuber, M. (contributor), Schmuck, K. S. (contributor), Renk, O. (contributor), Issa, I. (contributor), Burtscher, M. (contributor) & Gammer, C. (contributor)
3 Jun 2021Activity: Talk or presentation › Oral presentation
Fracture behavior of distinct interfaces of two intermetallic TiAl alloys
Burtscher, M. (Speaker), Alfreider, M. (contributor), Clemens, H. (contributor), Gammer, C. (contributor) & Kiener, D. (contributor)
4 Sept 2022Activity: Talk or presentation › Invited talk
Examining local fracture toughness of grain size tailored WCu nano-composites
Schmuck, K. S. (Speaker), Alfreider, M. (contributor), Burtscher, M. (contributor), Wurmshuber, M. (contributor) & Kiener, D. (contributor)
23 May 2023Activity: Talk or presentation › Oral presentation
Enhanced Mechanical Properties of Interface-strengthened UFG Tungsten and Tungsten-based Nanocomposites
Wurmshuber, M. (Speaker), Doppermann, S. (contributor), Schmuck, K. S. (contributor), Alfreider, M. (contributor), Burtscher, M. (contributor), Wurster, S. (contributor) & Kiener, D. (Speaker)
15 Mar 2021Activity: Talk or presentation › Oral presentation
Dislocation emission from crack tips in Cr studied by in-situ TEM
Burtscher, M. (contributor), Issa, I. (contributor), Schmuck, K. S. (contributor), Gammer, C. (contributor), Sandfeld, S. (contributor) & Kiener, D. (Speaker)
2023Activity: Talk or presentation › Invited talk
Complementary in-situ methods for crack evaluation within high-temperature materials at ambient conditions
Burtscher, M. (Speaker), Alfreider, M. (contributor), Wurmshuber, M. (contributor), Schmuck, K. S. (contributor), Clemens, H. (contributor), Mayer, S. (contributor) & Kiener, D. (contributor)
17 Mar 2021Activity: Talk or presentation › Oral presentation
Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites
Wurmshuber, M. (Speaker), Schmuck, K. S. (contributor), Doppermann, S. (contributor), Burtscher, M. (contributor), Bodlos, R. (contributor), Romaner, L. (contributor) & Kiener, D. (contributor)
17 Sept 2021Activity: Talk or presentation › Oral presentation
Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites
Kiener, D. (Invited speaker), Wurmshuber, M. (Speaker), Doppermann, S. (contributor), Alfreider, M. (contributor), Issa, I. (contributor), Schmuck, K. S. (contributor), Burtscher, M. (contributor), Wurster, S. (contributor), Jakob, S. (contributor), Bodlos, R. (contributor), Romaner, L. (contributor), Gammer, C. (contributor), Maier-Kiener, V. (contributor) & Clemens, H. (contributor)
29 Nov 2021Activity: Talk or presentation › Oral presentation
Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites
Kiener, D. (Invited speaker), Wurmshuber, M. (Speaker), Schmuck, K. S. (contributor), Issa, I. (contributor) & Burtscher, M. (contributor)
3 Dec 2021Activity: Talk or presentation › Oral presentation
Characterisation of a hot-extruded β-solidifying TiAl alloy for high-performance automotive applications
Burtscher, M. (Speaker), Klein, T. (contributor), Lehmann, O. (contributor), Lindemann, J. (contributor), Güther, V. (contributor), Mayer, S. (contributor) & Clemens, H. (contributor)
21 Apr 2017Activity: Talk or presentation › Oral presentation
