Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites

Activity: Talk or presentation Oral presentation

Participants

Date

3 Dec 2021

Daniel Kiener - Invited speaker

Michael Wurmshuber - Speaker

Klemens Silvester Schmuck - contributor

Inas Issa - contributor

Michael Burtscher - contributor

3 Dec 2021

Event (Conference)

TitleInternational Conference on Advanced Materials and Mechanical Characterization
Abbrev. TitleICAMMC
Period3/12/214/12/21
LocationVirtual
Country/TerritoryIndia
Degree of recognitionInternational event