Christoph Kirchlechner
(Former)
Research output
- Published
A new method for polychromatic X-ray μLaue diffraction on a Cu pillar using an energy-dispersive pn-junction charge-coupled device
Abboud, A., Kirchlechner, C., Send, S., Micha, J. S., Ulrich, O., Pashniak, N., Strüder, L. W. J., Keckes, J. & Pietsch, U., 2014, In: Review of scientific instruments. 85, p. 1139011-1139018Research output: Contribution to journal › Article › Research › peer-review
- Published
In-situ observation of stress-induced stochastic twin boundary motion in off stoichiometric NiMnGa single crystals
Barabash, R., Kirchlechner, C., Robach, O., Ulrich, O., Micha, J.-S., Sozinov, A. & Barabash, O., 2013, In: Applied physics letters. 103, p. 219091-219095Research output: Contribution to journal › Article › Research › peer-review
- Published
Effect of microstructure on electro-mechanical behavior of Cu films on polyimide
Berger, J., Glushko, O., Marx, V. M., Kirchlechner, C. & Cordill, M., 2016, In: JOM.Research output: Contribution to journal › Article › Research › peer-review
- E-pub ahead of print
Microstructural influence on the cyclic electro-mechanical behaviour of ductile films on polymer substrates
Cordill, M., Glushko, O., Kleinbichler, A., Putz, B., Többens, D. & Kirchlechner, C., 17 Sept 2017, (E-pub ahead of print) In: Thin solid films. 644.2017, 31. December, p. 166-172 7 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Ductile film delamination from compliant substrates using hard overlayers
Cordill, M. J., Marx, V. M. & Kirchlechner, C., 2014, In: Thin solid films. 571, p. 302-307Research output: Contribution to journal › Article › Research › peer-review
- Published
Temperature dependence of residual stress gradients in shot-peened steel coated with CrN
Daniel, R., Keckes, J., Kirchlechner, C., Maier, G., Martinschitz, K. J. & Mitterer, C., 2008, In: Materials Science Forum .Research output: Contribution to journal › Article › Research › peer-review
Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior
Du, C., Soeler, R., Völker, B., Matoy, K., Zechner, J., Langer, G., Reisinger, M., Todt, J., Kirchlechner, C. & Dehm, G., 1 Dec 2019, In: Materialia. 8.2019, 100503.Research output: Contribution to journal › Article › Research › peer-review
- Published
Recovery of electrical resistance in copper films on polyethylene terephthalate subjected to a tensile strain
Glushko, O., Marx, V. M., Kirchlechner, C., Zizak, I. & Cordill, M. J., 2014, In: Thin solid films. 552, p. 141-145Research output: Contribution to journal › Article › Research › peer-review
- Published
Differences in deformation behavior of bicrystalline Cu micropillars containing a twin boundary or a large-angle grain boundary
Imrich, P., Kirchlechner, C., Motz, C. & Dehm, G., 2014, In: Acta materialia. 73, p. 240-250Research output: Contribution to journal › Article › Research › peer-review
- Published
Internal and external stresses: In situ TEM compression of Cu bicrystals containing a twin boundary
Imrich, P. J., Kirchlechner, C., Kiener, D. & Dehm, G., 15 Apr 2015, In: Scripta materialia. 100, p. 94-97 4 p.Research output: Contribution to journal › Article › Research › peer-review
