Department Materials Science
Organisational unit: Departments and Institutes
2261 - 2270 out of 5,394Page size: 10
Research output
- 2015
- Published
Internal and external stresses: In situ TEM compression of Cu bicrystals containing a twin boundary
Imrich, P. J., Kirchlechner, C., Kiener, D. & Dehm, G., 15 Apr 2015, In: Scripta materialia. 100, p. 94-97 4 p.Research output: Contribution to journal › Article › Research › peer-review
- E-pub ahead of print
Enhancement of creep properties and microstructural stability of intermetallic β-solidifying γ-TiAl based alloys
Kastenhuber, M., Rashkova, B., Clemens, H. & Mayer, S., 14 Apr 2015, (E-pub ahead of print) In: Intermetallics. 63.2015, August, p. 19-26 8 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Bruchzähigkeitsmessung an keramischen Scheiben und Platten
Lube, T., Rasche, S. & Nindhia, T. G. T., 9 Apr 2015.Research output: Contribution to conference › Poster › Research
- Published
Einfluss der Korngröße auf des Rissfortschrittsverhalten von Nickel
Leitner, T., Hohenwarter, A. & Pippan, R., 9 Apr 2015.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Influence of Microstructure on the Deformation Behaviour of Chromium
Fritz, R., Wimler, D., Krautgasser, C., Leitner, A., Maier, V. & Kiener, D., 9 Apr 2015.Research output: Contribution to conference › Poster › Research
- Published
Microstructural investigations of a nanocrystalline high-entropy alloy
Schuh, B., Hohenwarter, A., Mendez Martin, F., Clemens, H. & Pippan, R., 8 Apr 2015, p. 319.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Schadensanalyse an einem keramischen keramischen Kugellager
Harrer, W., Deluca, M. & Morrell, R., 8 Apr 2015, p. 1 - 1. 1 p.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process
Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Apr 2015, In: Journal of Microelectronics and Electronic Packaging. 12.2015, 2, p. 80-85 6 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Heat development at the microscale in ceramic components - thermography and complementary tools
Röhrig, S., Petschenig, I., Bermejo, R., Hofstätter, M., Aldrian, F., Danzer, R. & Supancic, P., 1 Apr 2015Research output: Other contribution › Research
- Published
Mechanical characterization of miniaturized functional substrates and components in different environments
Bermejo, R., Krautgasser, C., Deluca, M., Pletz, M., Supancic, P., Aldrian, F. & Danzer, R., 1 Apr 2015Research output: Other contribution › Research
