Department Materials Science
Organisational unit: Departments and Institutes
4361 - 4370 out of 5,473Page size: 10
Research output
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Silicon Nitride Materials for Hot-working of High Strength Metal Wires
Danzer, R. & Lengauer, M., 2010, In: Engineering Failure Analysis. 17, p. 596-606Research output: Contribution to journal › Article › Research › peer-review
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Silicon Nitride Tools for Hot Rolling of High Alloyed Steel and Superalloy Wires
Lengauer, M. & Danzer, R., 2008, In: Journal of the European Ceramic Society. 28, p. 2289-2298Research output: Contribution to journal › Article › Research › peer-review
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Silicon Nitride Tools for Hot rolling of High Alloyed Steel and Superalloy Wires - Load analysis and First Practical Tests
Danzer, R., Lengauer, M., Zleppnig, W. & Harrer, W., 2007, In: International journal of materials research : IJMR ; Zeitschrift für Metallkunde. 98, p. 1104-1114Research output: Contribution to journal › Article › Research › peer-review
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Silver nanoparticles sintering at low temperature on a copper substrate: In situ characterisation under inert atmosphere and air
Zalesak, J., 2012, In: Journal of Mining and Metallurgy, Section B: Metallurgy. 48, 1, p. 63-71 9 p.Research output: Contribution to journal › Article › Research › peer-review
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Simulation of dynamic and meta-dynamic recrystallization behavior of forged Alloy 718 parts using a multi-class grain size model
Gruber, C., Raninger, P., Stanojevic, A., Godor, F., Rath, M., Kozeschnik, E. & Stockinger, M., Jan 2021, In: Materials. 14, 1, p. 1-15 15 p., 111.Research output: Contribution to journal › Article › Research › peer-review
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Simulation of nanoindentation: a discrete dislocation study
Kreuzer, H. G. M. & Pippan, R., 2004.Research output: Contribution to conference › Poster › Research › peer-review
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Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
Macurova, K., Angerer, P., Antretter, T., Bermejo Moratinos, R., Maia, W., Schöngrundner, R., Krivec, T., Morianz, M. & Brizoux, M., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Simulation of the mechanical response of the individual intermetallic phases in multi-phase γ titanium aluminides
Seligmann, B., Spörk-Erdely, P. & Antretter, T., 2023.Research output: Contribution to conference › Poster › Research
