Chair of Mechanics (400)
Organisational unit: Chair
61 - 70 out of 791Page size: 10
Research output
- 2021
- Published
Surface stress of gold nanoparticles revisited
Holec, D., Löfler, L., Zickler, G., Vollath, D. & Fischer, F-D., 1 Aug 2021, In: International journal of solids and structures. 224.2021, 1 August, p. 1-13 13 p., 111044.Research output: Contribution to journal › Article › Research › peer-review
- Published
Ductile failure modelling in pre-cracked solids using coupled fracture locus theory
Baltic, S., Magnien, J., Kolitsch, S., Gänser, H-P., Antretter, T. & Hammer, R., Jul 2021, In: Engineering Fracture Mechanics. 252.2021, July, 13 p., 107845.Research output: Contribution to journal › Article › Research › peer-review
- Published
MUL 4.0 – Digitalisierung der Wertschöpfungskette vom Rohmaterial bis hin zum Recycling
Woschank, M., Ralph, B. J., Kaiblinger, A., Miklautsch, P., Pacher, C., Sorger, M., Zsifkovits, H., Stockinger, M., Pogatscher, S., Antretter, T. & Antrekowitsch, H., 2 Jun 2021, In: Berg- und hüttenmännische Monatshefte : BHM. 166, 6, p. 309-313Research output: Contribution to journal › Article › Research › peer-review
- Published
Evaluation of Cement-Casing & Cement-Rock Bond Integrity during Well Operations.
Lamik, A., Thonhauser, G., Ravi, K., Prohaska-Marchried, M., Pittino, G. & Antretter, T., 27 May 2021, p. 1-13. 13 p.Research output: Contribution to conference › Paper › peer-review
- Published
Machine learning assisted calibration of a ductile fracture locus model
Baltic, S., Asadzadeh, M. Z., Hammer, P., Magnien, J., Gänser, H. P., Antretter, T. & Hammer, R., May 2021, In: Materials and Design. 203.2021, May, 15 p., 109604.Research output: Contribution to journal › Article › Research › peer-review
- Published
Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics
Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Role of elastic strain energy in spheroidal precipitates revisited
Böhm, H. J., Zickler, G., Fischer, F-D. & Svoboda, J., Apr 2021, In: Mechanics of materials. 155, April, 6 p., 103781.Research output: Contribution to journal › Article › Research › peer-review
- Published
Solutions of critical raw materials issues regarding iron-based alloys
Novák, P., Bellezze, T., Cabibbo, M., Gamsjäger, E., Wießner, M., Rajnovic, D., Jaworska, L., Hanus, P., Shishkin, A., Goel, G. & Goel, S., 2 Feb 2021, In: Materials. 14, 4, p. 1-36 36 p., 899.Research output: Contribution to journal › Review article › peer-review
- Published
Analysis of shape, orientation and interface properties of Mo2C precipitates in Fe using ab-initio and finite element method calculations
Leitner, S., Scheiber, D., Dengg, T., Spitaler, J., Antretter, T. & Ecker, W., 1 Feb 2021, In: Acta materialia. 204.2021, 1 February, 11 p., 116478.Research output: Contribution to journal › Article › Research › peer-review
