Chair of Mechanics (400)
Organisational unit: Chair
281 - 290 out of 794Page size: 10
Research output
- 2015
- Published
Fracture mechanics of thin film systems on the sub-micron scale
Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T. & Ganser, H. P., 6 May 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 7103088Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Characterization of stainless steels by means of high temperature X-ray diffraction
Gamsjäger, E., Wiessner, M. & Angerer, P., 30 Apr 2015, Stainless Steel Conference 2015-Proceedings.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process
Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Apr 2015, In: Journal of Microelectronics and Electronic Packaging. 12.2015, 2, p. 80-85 6 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Stress, deformation and diffusion interactions in solids - A simulation study
Fischer, F. D. & Svoboda, J., 26 Feb 2015, In: Journal of the mechanics and physics of solids. 78, p. 427-442 16 p., 2612.Research output: Contribution to journal › Article › Research › peer-review
- Published
3D numerical study on microwave induced stresses in inhomogeneous hard rocks
Toifl, M., Meisels, R., Hartlieb, P., Kuchar, F. & Antretter, T., 2015.Research output: Contribution to conference › Paper
- Published
3D numerical study on microwave induced stresses in inhomogeneous hard rocks
Toifl, M., Meisels, R., Hartlieb, P., Kuchar, F. & Antretter, T., 2015.Research output: Contribution to conference › Presentation › Research
- Published
Degradation analysis of thin die-attach layer under cyclic thermal load in microelectronics packaging
Pelisset, T. M. A., 2015Research output: Thesis › Doctoral Thesis
- Published
Degradation of the electrical performance of Printed Circuit Boards (PCBs) after cyclic thermo-mechanical loading
Fellner, K., 2015Research output: Thesis › Doctoral Thesis
- Published
Elucidating the Sorption Mechanism of Dibromomethane in Disordered Mesoporous Silica Adsorbents
Stoeckel, D., Wallacher, D., Zickler, G., Thommes, M. & Smarsly, B., 2015, In: Langmuir.Research output: Contribution to journal › Article › Research › peer-review
- Published
Experimental characterization and modelling of triaxial residual stresses in straightened railway rails
Kaiser, R., Stefenelli, M., Hatzenbichler, T., Antretter, T., Hofmann, M., Keckes, J. & Buchmayr, B., 2015, In: The Journal of Strain Analysis for Engineering Design. 50, 3, p. 190-198 9 p.Research output: Contribution to journal › Article › Research › peer-review
