Chair of Mechanics (400)
Organisational unit: Chair
521 - 530 out of 810Page size: 10
Research output
- Published
Experimental and numerical investigation of the phenomenon squats in rails
Gschwandl, T. J., 2023Research output: Thesis › Doctoral Thesis
- E-pub ahead of print
Investigation of probable squat growth from initial surface cracks in rails using a three-dimensional rollover simulation
Gschwandl, T. J., Antretter, T., Künstner, D., Scheriau, S. & Daves, W., 29 Apr 2024, (E-pub ahead of print) In: Proceedings of the Institution of Mechanical Engineers, Part F: Journal of Rail and Rapid Transit. 238.2024, 4, p. 406-413 8 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Experimental and Numerical Visualisation of Subsurface Rail Deformation in a Full-Scale Wheel–Rail Test Rig
Gschwandl, T. J., Weniger, T. M., Antretter, T., Künstner, D., Scheriau, S. & Daves, W., Jun 2023, In: Metals. 13.2023, 6, 18 p., 1089.Research output: Contribution to journal › Article › Research › peer-review
- Published
On the Road Towards Understanding Squats - Metallographic Investigations of Rails
Gschwandl, T., Spalek, A., Antretter, T. & Daves, W., 2025, Advances in Dynamics of Vehicles on Roads and Tracks III - Proceedings of the 28th Symposium of the International Association of Vehicle System Dynamics, IAVSD 2023, Rail Vehicles. Huang, W. & Ahmadian, M. (eds.). p. 314-323 10 p. (Lecture Notes in Mechanical Engineering).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Finite element analysis of arbitrarily complex electronics devices
Gschwandl, M., Fuchs, P., Fellner, K., Antretter, T., Krivec, T. & Tao, Q., 2016, Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016. p. 497-500Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers
Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. G. & Novàk, P., 2018.Research output: Contribution to conference › Poster › Research
- Published
Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers
Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. G. & Novàk, P., 2018, EMAP 2018 Conference Proceedings. 4 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
A Modeling Framework for Enhanced Reliability of Printed Circuit Boards and Power Electronics
Gschwandl, M., 2020Research output: Thesis › Doctoral Thesis
- Published
A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip
Gschwandl, M., Fuchs, P. F., Antretter, T., Pfost, M., Mitev, I., Tao, Q., Krivec, T., Schingale, A. & Decker, M., 2019, p. 1509-1514.Research output: Contribution to conference › Paper › peer-review
- Published
Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics
Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
