Chair of Chemistry of Polymeric Materials (231)

Organisational unit: Chair

Research output

  1. 2023
  2. Published

    Development of electrically conductive resins for DLP printing applications

    Feigl, V., 2023

    Research output: ThesisMaster's Thesis

  3. Published

    Development of reprocessable adhesive systems for carbon and glass fiber reinforced plastics applications

    Bautista-Anguís, D., Reiner, L., Wolfberger, A., Maar, S., Röper, F., Wolfahrt, M., Schlögl, S. & Hader-Kregl, L., 2023.

    Research output: Contribution to conferencePosterResearch

  4. Published

    Development of reprocessable adhesive systems for carbon and glass fiber reinforced polymer applications

    Bautista-Anguís, D., Reiner, L., Wolfberger, A. & Schlögl, S., 2023.

    Research output: Contribution to conferencePosterResearch

  5. Published

    Digital light processing 3D printing of dynamic magneto-responsive thiol-acrylate composites

    Cazin, I., Rossegger, E., Roppolo, I., Sangermano, M., Granitzer, P., Rumpf, K. & Schlögl, S., 2023.

    Research output: Contribution to conferencePosterResearch

  6. Published
  7. Published

    Food safety, plastics and sustainability

    Fink, J., 2023

    Research output: Book/ReportBookResearch

  8. Published

    Frontal Polymerization of Dynamic Networks

    Schmidleitner, C., Hirner, S., Reisinger, D., Schlögl, S. & Rossegger, E., 2023.

    Research output: Contribution to conferencePosterResearch

  9. Published

    Implementation and investigation of a vitrimer-like behavior in HXNBR elastomer and elastomer composites

    Grabmayer, T., Kaiser, S., Jandl, J., Novak, P., Wurzer, S., Kern, W. & Schlögl, S., 2023.

    Research output: Contribution to conferencePosterResearch

  10. Published

    Improved nanoindentation methods for polymer based multilayer film cross-sections

    Christoefl, P., Jakes, J. E., Geier, J., Pinter, G., Oreski, G., Stone, D. & Teichert, C., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  11. Published
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