15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014
Activity: Participating in or organising an event › Participation in conference
Participants
- Katerina Macurova - Speaker
Date
7 Apr 2014 → 9 Apr 2014
Katerina Macurova - Speaker
Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
7 Apr 2014 → 9 Apr 2014
15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014
Duration | 7 Apr 2014 → 9 Apr 2014 |
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City | Gent |
Country/Territory | Belgium |
Degree of recognition | International event |
Event: Conference