15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014

Activity: Participating in or organising an eventParticipation in conference

Participants

Date

7 Apr 20149 Apr 2014

Katerina Macurova - Speaker

Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
7 Apr 20149 Apr 2014

15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014

Duration7 Apr 20149 Apr 2014
CityGent
Country/TerritoryBelgium
Degree of recognitionInternational event

Event: Conference