Institute of Electrical and Electronics Engineers
Herausgeber (Verlag): Verlag/Herausgebende Institution › Herausgeber (Verlag)
Publikationen
- Veröffentlicht
Oscillation Damping With Input Shaping in Individual Metering Hydraulic Systems
Rath, G., Zaev, E. & Babunski, D., 1 Juni 2019, 2019 8th Mediterranean Conference on Embedded Computing, MECO 2019 - Proceedings. Stojanovic, R., Jozwiak, L., Lutovac, B. & Jurisic, D. (Hrsg.). Institute of Electrical and Electronics Engineers, 8760056. (2019 8th Mediterranean Conference on Embedded Computing, MECO 2019 - Proceedings).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
The influence of surface modification on the electrical properties of silicon carbide flakes
Pleşa, I., Schlögl, S., Radl, S. V., Mühlbacher, I. & Schichler, U., 24 Juni 2015, 2015 9th International Symposium on Advanced Topics in Electrical Engineering, ATEE 2015. Institute of Electrical and Electronics Engineers, S. 460-463 4 S. 7133858. (2015 9th International Symposium on Advanced Topics in Electrical Engineering, ATEE 2015).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Characterization and modeling of a typical curing material for photoresist films
Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics
Peng, C., Tao, Q., Krivec, T., Casas, G., Latorre, S., Antretter, T., Macher, J. & Fuchs, P., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
A Flexible CAEX Based Model for Standard Integration in Tunnelling
Paskaleva, G., Mazak-Huemer, A., Waldhart, J. & Ehrbar, H., 2021, 2021 ETFA – IEEE 26th International Conference on Emerging Technologies and Factory Automation. Institute of Electrical and Electronics Engineers, S. 1-8 8 S.Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
An inverse problem approach to approximating sensor data in cyber physical systems
O'Leary, P., Harker, M. & Gugg, C., 6 Juli 2015, Conference Record - IEEE Instrumentation and Measurement Technology Conference. Institute of Electrical and Electronics Engineers, Band 2015-July. S. 1717-1722 6 S. 7151539Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Estimating Parameters of a Sine Wave by the Method of Variable Projection
O'Leary, P. & Ninevski, D., 17 Mai 2021, I2MTC 2021 - IEEE International Instrumentation and Measurement Technology Conference, Proceedings. Institute of Electrical and Electronics Engineers, 9459842. (Conference Record - IEEE Instrumentation and Measurement Technology Conference; Band 2021-May).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Automatic Synthesis of Admissible Functions for Variational Learning
O'Leary, P., Ninevski, D. & Terbuch, A., 2023, 2023 IEEE International Conference on Computational Intelligence and Virtual Environments for Measurement Systems and Applications (CIVEMSA 2023). Institute of Electrical and Electronics EngineersPublikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Instrumented Milling Process and Analysis for Tool Wear Measurement
Ninevski, D., Yifrach, Y. & O'Leary, P., 2023, 2023 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) (I2MTC 2023). Kuala Lumpur, Malaysia: Institute of Electrical and Electronics EngineersPublikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Input Impedance Modeling of Three-Level Multi-Stage NPC Topology
Makoschitz, M., Stoeckl, J. & Hribernik, W., 28 Aug. 2018, 2018 IEEE Transportation and Electrification Conference and Expo, ITEC 2018. Institute of Electrical and Electronics Engineers, S. 881-884 4 S. 8450192. (2018 IEEE Transportation and Electrification Conference and Expo, ITEC 2018).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
