Institute of Electrical and Electronics Engineers
Herausgeber (Verlag): Verlag/Herausgebende Institution › Herausgeber (Verlag)
Publikationen
Output Impedance Compensation of a Cascaded Advanced AC-Simulator
Jonke, P., Makoschitz, M., Biswas, S., Stockl, J. & Ertl, H., Juni 2020, 2020 IEEE 29th International Symposium on Industrial Electronics, ISIE 2020 - Proceedings. Institute of Electrical and Electronics Engineers, S. 761-766 6 S. 9152397. (IEEE International Symposium on Industrial Electronics; Band 2020-June).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
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PermeabilityNets: Comparing Neural Network Architectures on a Sequence-to-Instance Task in CFRP Manufacturing
Stieber, S., Schroter, N., Fauster, E., Schiendorfer, A. & Reif, W., 2021, Proceedings - 20th IEEE International Conference on Machine Learning and Applications, ICMLA 2021. Wani, M. A., Sethi, I. K., Shi, W., Qu, G., Raicu, D. S. & Jin, R. (Hrsg.). Institute of Electrical and Electronics Engineers, S. 694-697 4 S. (Proceedings - 20th IEEE International Conference on Machine Learning and Applications, ICMLA 2021).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
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Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
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Real-time tensor polynomial approximation of crosshatch measured geometric surface data
Harker, M., O'Leary, P., Plessing, L., Hergan, P. & Fauster, E., 10 Juli 2018, I2MTC 2018 - 2018 IEEE International Instrumentation and Measurement Technology Conference: Discovering New Horizons in Instrumentation and Measurement, Proceedings. Institute of Electrical and Electronics Engineers, S. 1-6 6 S.Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
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Robust machine vision based displacement analysis for tunnel boring machines
Gugg, C. & O'Leary, P., 6 Juli 2015, Conference Record - IEEE Instrumentation and Measurement Technology Conference. Institute of Electrical and Electronics Engineers, Band 2015-July. S. 875-880 6 S. 7151384Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
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Simulation of stiff systems on real-time hardware
Zaev, E., Babunski, D., Tuneski, A. & Rath, G., 6 Juli 2018, 2018 7th Mediterranean Conference on Embedded Computing, MECO 2018 - Including ECYPS 2018, Proceedings. Institute of Electrical and Electronics Engineers, S. 1-4 4 S.Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
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Simultaneous approximation of measurement values and derivative data using discrete orthogonal polynomials
Ritt, R., Harker, M. & O'Leary, P., 1 Mai 2019, Proceedings - 2019 IEEE International Conference on Industrial Cyber Physical Systems, ICPS 2019. Institute of Electrical and Electronics Engineers, S. 282-289 8 S. 8780356. (Proceedings - 2019 IEEE International Conference on Industrial Cyber Physical Systems, ICPS 2019).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Start-up operation of active three-phase third harmonic injection rectifiers
Makoschitz, M., Hartmann, M. & Ertl, H., 2017, PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Institute of Electrical and Electronics Engineers, 7990893. (PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Survey on Technologies Driving the Smart Energy Sector
Stockl, J., Makoschitz, M., Strasser, T., Blanes, L. M., Janev, V., Lissa, P. & Seri, F., 2021, 2021 29th Telecommunications Forum, TELFOR 2021 - Proceedings. Institute of Electrical and Electronics Engineers, (2021 29th Telecommunications Forum, TELFOR 2021 - Proceedings).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
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System Identification under General Norms for Linear Parameter Varying State-Space Systems via Sparse Matrix Methods
Harker, M. & Rath, G., 2022, 2022 IEEE/SICE International Symposium on System Integration, SII 2022. Institute of Electrical and Electronics Engineers, S. 317-322 6 S. (2022 IEEE/SICE International Symposium on System Integration, SII 2022).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband