Institute of Electrical and Electronics Engineers
Herausgeber (Verlag): Verlag/Herausgebende Institution › Herausgeber (Verlag)
Publikationen
- 2021
- Veröffentlicht
Instrumentation of a Roving Inspection Test Rig with Surface Geometry Measurement of Fiber Bundles
Lehner, S., Neunkirchen, S., Fauster, E. & O'Leary, P., 17 Mai 2021, I2MTC 2021 - IEEE International Instrumentation and Measurement Technology Conference, Proceedings. IEEE Xplore (online): Institute of Electrical and Electronics Engineers, 9459889. (Conference Record - IEEE Instrumentation and Measurement Technology Conference; Band 2021-May).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Development and Hardware-in-the-Loop Simulation of an Air Purifier Automatic Control System
Babunski, D., Zaev, E., Poposki, F., Koleva, R. & Rath, G., 7 Juni 2021, 2021 10th Mediterranean Conference on Embedded Computing, MECO 2021. Institute of Electrical and Electronics Engineers, 9460141. (2021 10th Mediterranean Conference on Embedded Computing, MECO 2021).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Hardware-in-the-loop for Simulation and Control of Greenhouse Climate
Zaev, E., Babunski, D., Jovanov, A., Rath, G. & Payr, M. P., 7 Juni 2021, 2021 10th Mediterranean Conference on Embedded Computing, MECO 2021. Budva: Institute of Electrical and Electronics Engineers, 9460206. (2021 10th Mediterranean Conference on Embedded Computing, MECO 2021).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Effects of artificial ageing tests on EVA degradation: Influence of microclimate and methodology approach
Barretta, C., Oreski, G., Kyranaki, N., Mansour, D. E., Betts, T. R., Bauermann, L. P. & Resch-Fauster, K., 20 Juni 2021, 2021 IEEE 48th Photovoltaic Specialists Conference, PVSC 2021. Institute of Electrical and Electronics Engineers, S. 312-315 4 S. (Conference Record of the IEEE Photovoltaic Specialists Conference).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Investigating the influence of surface hardness and energy on the perceived stickiness of polymer coatings.
Griesser, M., Ules, T., Schlogl, S. & Gruber, D. P., 6 Juli 2021, 2021 IEEE World Haptics Conference, WHC 2021. Institute of Electrical and Electronics Engineers, S. 1148 1 S. (2021 IEEE World Haptics Conference, WHC 2021).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
A probabilistic approach for complete coverage path planning with low-cost systems
Rottmann, N., Denz, R., Bruder, R. & Rueckert, E., Aug. 2021, 2021 10th European Conference on Mobile Robots, ECMR 2021 - Proceedings. Institute of Electrical and Electronics Engineers, (2021 10th European Conference on Mobile Robots, ECMR 2021 - Proceedings).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Buch/Sammelband › Forschung
- Veröffentlicht
Decomposition of a Periodic Perturbed Signal with Unknown Perturbation Frequency by the Method of Variable Projection
Handler, J., Ninevski, D. & O'Leary, P., 20 Dez. 2021, 2021 7th International Conference on Mechanical Engineering and Automation ICMEAS 2021. Institute of Electrical and Electronics EngineersPublikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- 2022
- Veröffentlicht
Application of Artificial Neural Network to Predict the Thermal and Thermomechanical Behavior of Refractory Linings
Hou, A., Jin, S., Gruber, D. & Harmuth, H., 2022, 2022 International Joint Conference on Neural Networks, IJCNN 2022 - Proceedings. Institute of Electrical and Electronics Engineers, (Proceedings of the International Joint Conference on Neural Networks; Band 2022-July).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process
Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S. & Wolfberger, A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Characterization and modeling of a typical curing material for photoresist films
Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband