Development and Hardware-in-the-Loop Simulation of an Air Purifier Automatic Control System

Babunski, D., Zaev, E., Poposki, F., Koleva, R. & Rath, G., 7 Juni 2021, 2021 10th Mediterranean Conference on Embedded Computing, MECO 2021. Institute of Electrical and Electronics Engineers, 9460141. (2021 10th Mediterranean Conference on Embedded Computing, MECO 2021).

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Effects of artificial ageing tests on EVA degradation: Influence of microclimate and methodology approach

Barretta, C., Oreski, G., Kyranaki, N., Mansour, D. E., Betts, T. R., Bauermann, L. P. & Resch-Fauster, K., 20 Juni 2021, 2021 IEEE 48th Photovoltaic Specialists Conference, PVSC 2021. Institute of Electrical and Electronics Engineers, S. 312-315 4 S. (Conference Record of the IEEE Photovoltaic Specialists Conference).

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Grid Load Mitigation in EV Fast Charging Stations Through Integration of a High-Performance Flywheel Energy Storage System with CFRP Rotor

Buchroithner, A., Presmair, R., Haidl, P., Wegleiter, H., Thormann, B., Kienberger, T., Auer, P. & Domitner, J., 2021, 2021 IEEE Green Energy and Smart Systems Conference, IGESSC 2021. Institute of Electrical and Electronics Engineers, (2021 IEEE Green Energy and Smart Systems Conference, IGESSC 2021).

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Dynamic Mechanical Response in Epoxy Nanocomposites Incorporating Various Nano-Silica Architectures

Chaudhary, S., Vryonis, O., Vaughan, A. S., Andritsch, T. & Feuchter, M., 2022, ICD 2022 - IEEE 2022 4th International Conference on Dielectrics, Proceedings. Institute of Electrical and Electronics Engineers, S. 86-89 4 S. (ICD 2022 - IEEE 2022 4th International Conference on Dielectrics, Proceedings).

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Improved nanoindentation methods for polymer based multilayer film cross-sections

Christoefl, P., Jakes, J. E., Geier, J., Pinter, G., Oreski, G., Stone, D. & Teichert, C., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

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Learning to Drive with Deep Reinforcement Learning

Chukamphaeng, N., Pasupa, K., Antenreiter, M. & Auer, P., 21 Jan. 2021, KST 2021 - 2021 13th International Conference Knowledge and Smart Technology. Institute of Electrical and Electronics Engineers, S. 147-152 6 S. 9415770. (KST 2021 - 2021 13th International Conference Knowledge and Smart Technology).

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Identifying the potential of SiC technology for PV inverters

Eskilson, T., Jehle, A., Schmidt, P., Makoschitz, M. & Baumgartner, F., 2023, 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. Institute of Electrical and Electronics Engineers, (2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe).

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Investigating the influence of surface hardness and energy on the perceived stickiness of polymer coatings.

Griesser, M., Ules, T., Schlogl, S. & Gruber, D. P., 6 Juli 2021, 2021 IEEE World Haptics Conference, WHC 2021. Institute of Electrical and Electronics Engineers, S. 1148 1 S. (2021 IEEE World Haptics Conference, WHC 2021).

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Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. & Novak, P., 5 März 2019, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 8660763. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).

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