Institute of Electrical and Electronics Engineers
Herausgeber (Verlag): Verlag/Herausgebende Institution › Herausgeber (Verlag)
Publikationen
- Veröffentlicht
MEMS Based Inclinometers: Noise Characteristics and Suitable Signal Processing: Noise characteristics and suitable signal processing
Schmidt, R., O'Leary, P., Ritt, R. & Harker, M., 5 Juli 2017, I2MTC 2017 - 2017 IEEE International Instrumentation and Measurement Technology Conference, Proceedings. Institute of Electrical and Electronics Engineers, 7969830Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Unified Software Interface for Numerical Evaluation of Integrals and Derivatives of Fractional Order
Skovranek, T., Harker, M., Podlubny, I., O'Leary, P. & Petras, I., 27 Okt. 2020, Proceedings of the 2020 21st International Carpathian Control Conference, ICCC 2020. Petras, I. & Kacur, J. (Hrsg.). Institute of Electrical and Electronics Engineers, 9257225. (Proceedings of the 2020 21st International Carpathian Control Conference, ICCC 2020).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
PermeabilityNets: Comparing Neural Network Architectures on a Sequence-to-Instance Task in CFRP Manufacturing
Stieber, S., Schroter, N., Fauster, E., Schiendorfer, A. & Reif, W., 2021, Proceedings - 20th IEEE International Conference on Machine Learning and Applications, ICMLA 2021. Wani, M. A., Sethi, I. K., Shi, W., Qu, G., Raicu, D. S. & Jin, R. (Hrsg.). Institute of Electrical and Electronics Engineers, S. 694-697 4 S. (Proceedings - 20th IEEE International Conference on Machine Learning and Applications, ICMLA 2021).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Survey on Technologies Driving the Smart Energy Sector
Stockl, J., Makoschitz, M., Strasser, T., Blanes, L. M., Janev, V., Lissa, P. & Seri, F., 2021, 2021 29th Telecommunications Forum, TELFOR 2021 - Proceedings. Institute of Electrical and Electronics Engineers, (2021 29th Telecommunications Forum, TELFOR 2021 - Proceedings).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
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A novel method for solving an optimal control problem for a numerically stiff independent metering system
Stojanoski, G., Ninevski, D., Rath, G. & Harker, M., 26 Nov. 2020, 2020 Australian and New Zealand Control Conference, ANZCC 2020. Institute of Electrical and Electronics Engineers, S. 108-113 6 S. 9318391. (2020 Australian and New Zealand Control Conference, ANZCC 2020).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
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Hybrid Machine Learning for Anomaly Detection in Industrial Time-Series Measurement Data
Terbuch, A., O'Leary, P. & Auer, P., 2022, I2MTC 2022 - IEEE International Instrumentation and Measurement Technology Conference: Instrumentation and Measurement under Pandemic Constraints, Proceedings. Institute of Electrical and Electronics Engineers, (Conference Record - IEEE Instrumentation and Measurement Technology Conference).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
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A Rayleigh-Ritz Autoencoder
Terbuch, A., O'Leary, P., Ninevski, D., Hagendorfer, E. J., Schlager, E., Windisch, A. & Schweimer, C., 2023, 2023 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) (I2MTC 2023). Kuala Lumpur, Malaysia: Institute of Electrical and Electronics Engineers, S. 1-6Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
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A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process
Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S. & Wolfberger, A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
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Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts
Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M. & Fuchs, P., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Modeling of electrical networks in the cellular approach with regard to influencing variables on active and reactive power accuracy at different voltage levels
Traupmann, A. & Kienberger, T., 2019Publikationen: Elektronische/multimediale Veröffentlichungen › Webpublikation oder Website › Forschung