Institute of Electrical and Electronics Engineers
Herausgeber (Verlag): Verlag/Herausgebende Institution › Herausgeber (Verlag)
Publikationen
- Veröffentlicht
The Influence of Isolation on Learning in an Immersive Laboratory Environment
Holly, M., Sommer, S., Ruh, T., Stadlbauer, D., Rameshan, C. & Pirker, J., 2023, International Conference on Advanced Learning Technologies (ICALT). Chang, M., Chen, N.-S., Kuo, R., Rudolph, G., Sampson, D. G. & Tlili, A. (Hrsg.). Institute of Electrical and Electronics Engineers, Band 2023. S. 285-289 5 S. (2023 IEEE International Conference on Advanced Learning Technologies (ICALT)).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Application of Artificial Neural Network to Predict the Thermal and Thermomechanical Behavior of Refractory Linings
Hou, A., Jin, S., Gruber, D. & Harmuth, H., 2022, 2022 International Joint Conference on Neural Networks, IJCNN 2022 - Proceedings. Institute of Electrical and Electronics Engineers, (Proceedings of the International Joint Conference on Neural Networks; Band 2022-July).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Analysis and Verification of a Cascaded Advanced AC-Simulator with Non-Linear Loads
Jonke, P., Makoschitz, M., Biswas, S., Stockl, J. & Ertl, H., 9 Nov. 2020, 2020 IEEE 21st Workshop on Control and Modeling for Power Electronics, COMPEL 2020. Institute of Electrical and Electronics Engineers, 9265769. (2020 IEEE 21st Workshop on Control and Modeling for Power Electronics, COMPEL 2020).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Output Impedance Compensation of a Cascaded Advanced AC-Simulator
Jonke, P., Makoschitz, M., Biswas, S., Stockl, J. & Ertl, H., Juni 2020, 2020 IEEE 29th International Symposium on Industrial Electronics, ISIE 2020 - Proceedings. Institute of Electrical and Electronics Engineers, S. 761-766 6 S. 9152397. (IEEE International Symposium on Industrial Electronics; Band 2020-June).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
AC-sweep analysis and verification of an AC power source with virtual output impedance for validation of grid connected components
Jonke, P., Makoschitz, M., Sumanta, B., Stöckl, J. & Ertl, H., 2017, PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Institute of Electrical and Electronics Engineers, 7990902. (PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies
Kamble, V. G., Patel, D. R., Schipfer, C., Thalhamer, A., Zuendel, J., Krivec, T., Antretter, T. & Fuchs, P. F., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Numerical Investigation of Collective Motion of Cathode Spots
Kharicha, A., Karimi-Sibaki, E., Ludwig, A. & Wu, M., 15 Nov. 2018, 28th International Symposium on Discharges and Electrical Insulation in Vacuum: ISDEIV. Institute of Electrical and Electronics Engineers, Band 2. S. 467-469 3 S. (International Symposium on Discharges and Elevtrical Insultaion in Vacuum, ISDEIV).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Effect of water absorption on dielectric spectrum of nanocomposites
Kochetov, R., Tsekmes, I. A., Morshuis, P. H. F., Smit, J. J., Wanner, A. J., Wiesbrock, F. & Kern, W., 22 Aug. 2016, 34th Electrical Insulation Conference, EIC 2016. Institute of Electrical and Electronics Engineers, S. 579-582 4 S. 7548669Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Force based Tool Wear Detection using Shannon Entropy and Phase Plane
Kollment, W., O'Leary, P., Ritt, R. & Kluensner, T., 5 Juli 2017, I2MTC 2017 - 2017 IEEE International Instrumentation and Measurement Technology Conference, Proceedings. Institute of Electrical and Electronics Engineers, 7969765Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Force and acoustic emission measurements for condition monitoring of fine blanking tools
Kollment, W., O'Leary, P., Harker, M., Klunsner, T. & Eck, S., 10 Juli 2018, I2MTC 2018 - 2018 IEEE International Instrumentation and Measurement Technology Conference: Discovering New Horizons in Instrumentation and Measurement, Proceedings. Institute of Electrical and Electronics Engineers, S. 1-6 6 S.Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
