Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

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Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts. / Thalhamer, A.; Rossegger, E.; Hasil, S. et al.
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, 2023. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

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Harvard

Thalhamer, A, Rossegger, E, Hasil, S, Hrbinic, K, Feigl, V, Pfost, M & Fuchs, P 2023, Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts. in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Institute of Electrical and Electronics Engineers, 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Graz, Österreich, 16/04/23. https://doi.org/10.1109/EuroSimE56861.2023.10100754

APA

Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M., & Fuchs, P. (2023). Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts. In 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE56861.2023.10100754

Vancouver

Thalhamer A, Rossegger E, Hasil S, Hrbinic K, Feigl V, Pfost M et al. Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts. in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers. 2023. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023). doi: 10.1109/EuroSimE56861.2023.10100754

Author

Thalhamer, A. ; Rossegger, E. ; Hasil, S. et al. / Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, 2023. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

Bibtex - Download

@inproceedings{b7ecf247567d49cfb7a7532c1fe4dc5e,
title = "Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts",
author = "A. Thalhamer and E. Rossegger and S. Hasil and K. Hrbinic and V. Feigl and M. Pfost and P. Fuchs",
note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 ; Conference date: 16-04-2023 Through 19-04-2023",
year = "2023",
doi = "10.1109/EuroSimE56861.2023.10100754",
language = "English",
series = "2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023",
publisher = "Institute of Electrical and Electronics Engineers",
booktitle = "2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023",
address = "United States",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

AU - Thalhamer, A.

AU - Rossegger, E.

AU - Hasil, S.

AU - Hrbinic, K.

AU - Feigl, V.

AU - Pfost, M.

AU - Fuchs, P.

N1 - Publisher Copyright: © 2023 IEEE.

PY - 2023

Y1 - 2023

UR - http://www.scopus.com/inward/record.url?scp=85158112968&partnerID=8YFLogxK

U2 - 10.1109/EuroSimE56861.2023.10100754

DO - 10.1109/EuroSimE56861.2023.10100754

M3 - Conference contribution

AN - SCOPUS:85158112968

T3 - 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

BT - 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

PB - Institute of Electrical and Electronics Engineers

T2 - 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

Y2 - 16 April 2023 through 19 April 2023

ER -

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