Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads

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Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads. / Fellner, Klaus; Fuchs, Peter; Pinter, Gerald.
13th Youth Symposium on Experimental Solid Mechanics. 2014. S. 29-32.

Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

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APA

Fellner, K., Fuchs, P., & Pinter, G. (2014). Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads. In 13th Youth Symposium on Experimental Solid Mechanics (S. 29-32)

Vancouver

Fellner K, Fuchs P, Pinter G. Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads. in 13th Youth Symposium on Experimental Solid Mechanics. 2014. S. 29-32

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Bibtex - Download

@inproceedings{811087ef38d84b00aef59c8c585565a2,
title = "Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads",
author = "Klaus Fellner and Peter Fuchs and Gerald Pinter",
year = "2014",
language = "English",
pages = "29--32",
booktitle = "13th Youth Symposium on Experimental Solid Mechanics",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads

AU - Fellner, Klaus

AU - Fuchs, Peter

AU - Pinter, Gerald

PY - 2014

Y1 - 2014

M3 - Conference contribution

SP - 29

EP - 32

BT - 13th Youth Symposium on Experimental Solid Mechanics

ER -