Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads
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Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads. / Fellner, Klaus; Fuchs, Peter; Pinter, Gerald.
13th Youth Symposium on Experimental Solid Mechanics. 2014. S. 29-32.
13th Youth Symposium on Experimental Solid Mechanics. 2014. S. 29-32.
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Harvard
Fellner, K, Fuchs, P & Pinter, G 2014, Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads. in 13th Youth Symposium on Experimental Solid Mechanics. S. 29-32.
APA
Fellner, K., Fuchs, P., & Pinter, G. (2014). Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads. In 13th Youth Symposium on Experimental Solid Mechanics (S. 29-32)
Vancouver
Fellner K, Fuchs P, Pinter G. Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads. in 13th Youth Symposium on Experimental Solid Mechanics. 2014. S. 29-32
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Bibtex - Download
@inproceedings{811087ef38d84b00aef59c8c585565a2,
title = "Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads",
author = "Klaus Fellner and Peter Fuchs and Gerald Pinter",
year = "2014",
language = "English",
pages = "29--32",
booktitle = "13th Youth Symposium on Experimental Solid Mechanics",
}
RIS (suitable for import to EndNote) - Download
TY - GEN
T1 - Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads
AU - Fellner, Klaus
AU - Fuchs, Peter
AU - Pinter, Gerald
PY - 2014
Y1 - 2014
M3 - Conference contribution
SP - 29
EP - 32
BT - 13th Youth Symposium on Experimental Solid Mechanics
ER -
