Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices

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Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices. / Lassnig, Alice; Terziyska, Velislava L.; Zalesak, Jakub et al.
in: ACS Applied Nano Materials, Jahrgang 4.2021, Nr. 1, 28.12.2020, S. 61-70.

Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

Harvard

Lassnig, A, Terziyska, VL, Zalesak, J, Jörg, T, Toebbens, DM, Griesser, T, Mitterer, C, Pippan, R & Cordill, MJ 2020, 'Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices', ACS Applied Nano Materials, Jg. 4.2021, Nr. 1, S. 61-70. https://doi.org/10.1021/acsanm.0c02182

APA

Lassnig, A., Terziyska, V. L., Zalesak, J., Jörg, T., Toebbens, D. M., Griesser, T., Mitterer, C., Pippan, R., & Cordill, M. J. (2020). Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices. ACS Applied Nano Materials, 4.2021(1), 61-70. https://doi.org/10.1021/acsanm.0c02182

Vancouver

Lassnig A, Terziyska VL, Zalesak J, Jörg T, Toebbens DM, Griesser T et al. Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices. ACS Applied Nano Materials. 2020 Dez 28;4.2021(1):61-70. doi: 10.1021/acsanm.0c02182

Author

Lassnig, Alice ; Terziyska, Velislava L. ; Zalesak, Jakub et al. / Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates : Implications for Microelectronic Devices. in: ACS Applied Nano Materials. 2020 ; Jahrgang 4.2021, Nr. 1. S. 61-70.

Bibtex - Download

@article{cfb13d8e5c454299acc2ac1ffabbf3d5,
title = "Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices",
keywords = "brittle-ductile interface, film microstructure, nanosized Cu films, spontaneous buckles, thin film adhesion",
author = "Alice Lassnig and Terziyska, {Velislava L.} and Jakub Zalesak and Tanja J{\"o}rg and Toebbens, {Daniel M.} and Thomas Griesser and Christian Mitterer and Reinhard Pippan and Cordill, {Megan J.}",
note = "Publisher Copyright: {\textcopyright} 2020 American Chemical Society.",
year = "2020",
month = dec,
day = "28",
doi = "10.1021/acsanm.0c02182",
language = "English",
volume = "4.2021",
pages = "61--70",
journal = "ACS Applied Nano Materials",
issn = "2574-0970",
publisher = "American Chemical Society",
number = "1",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates

T2 - Implications for Microelectronic Devices

AU - Lassnig, Alice

AU - Terziyska, Velislava L.

AU - Zalesak, Jakub

AU - Jörg, Tanja

AU - Toebbens, Daniel M.

AU - Griesser, Thomas

AU - Mitterer, Christian

AU - Pippan, Reinhard

AU - Cordill, Megan J.

N1 - Publisher Copyright: © 2020 American Chemical Society.

PY - 2020/12/28

Y1 - 2020/12/28

KW - brittle-ductile interface

KW - film microstructure

KW - nanosized Cu films

KW - spontaneous buckles

KW - thin film adhesion

UR - http://www.scopus.com/inward/record.url?scp=85099212374&partnerID=8YFLogxK

U2 - 10.1021/acsanm.0c02182

DO - 10.1021/acsanm.0c02182

M3 - Article

AN - SCOPUS:85099212374

VL - 4.2021

SP - 61

EP - 70

JO - ACS Applied Nano Materials

JF - ACS Applied Nano Materials

SN - 2574-0970

IS - 1

ER -

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