Laser Ultrasonic Thin Film Characterization of Si-Cu-Al-Cu Multi-Layered Stacks

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

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Laser Ultrasonic Thin Film Characterization of Si-Cu-Al-Cu Multi-Layered Stacks. / Grünwald, Eva; Nuster, Robert; Paltauf, Günther et al.
in: Materials Today: Proceedings, Jahrgang 4.2017, Nr. 7, Part 2, 19.09.2017, S. 7122-7127.

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

Harvard

Grünwald, E, Nuster, R, Paltauf, G, Maier, T, Wimmer-Teubenbacher, R, Konetschnik, R, Kiener, D, Leitgeb, V, Köck, A & Brunner, R 2017, 'Laser Ultrasonic Thin Film Characterization of Si-Cu-Al-Cu Multi-Layered Stacks', Materials Today: Proceedings, Jg. 4.2017, Nr. 7, Part 2, S. 7122-7127. https://doi.org/10.1016/j.matpr.2017.08.006

APA

Grünwald, E., Nuster, R., Paltauf, G., Maier, T., Wimmer-Teubenbacher, R., Konetschnik, R., Kiener, D., Leitgeb, V., Köck, A., & Brunner, R. (2017). Laser Ultrasonic Thin Film Characterization of Si-Cu-Al-Cu Multi-Layered Stacks. Materials Today: Proceedings, 4.2017(7, Part 2), 7122-7127. Vorzeitige Online-Publikation. https://doi.org/10.1016/j.matpr.2017.08.006

Vancouver

Grünwald E, Nuster R, Paltauf G, Maier T, Wimmer-Teubenbacher R, Konetschnik R et al. Laser Ultrasonic Thin Film Characterization of Si-Cu-Al-Cu Multi-Layered Stacks. Materials Today: Proceedings. 2017 Sep 19;4.2017(7, Part 2):7122-7127. Epub 2017 Sep 19. doi: 10.1016/j.matpr.2017.08.006

Author

Grünwald, Eva ; Nuster, Robert ; Paltauf, Günther et al. / Laser Ultrasonic Thin Film Characterization of Si-Cu-Al-Cu Multi-Layered Stacks. in: Materials Today: Proceedings. 2017 ; Jahrgang 4.2017, Nr. 7, Part 2. S. 7122-7127.

Bibtex - Download

@article{917c07989e014345afb8489482dd95f0,
title = "Laser Ultrasonic Thin Film Characterization of Si-Cu-Al-Cu Multi-Layered Stacks",
keywords = "Laser Ultrasound, Multi-Layered Systems, Stack Charakterization, Thin Film Characterization",
author = "Eva Gr{\"u}nwald and Robert Nuster and G{\"u}nther Paltauf and Thomas Maier and Robert Wimmer-Teubenbacher and Ruth Konetschnik and Daniel Kiener and Verena Leitgeb and Anton K{\"o}ck and Roland Brunner",
year = "2017",
month = sep,
day = "19",
doi = "10.1016/j.matpr.2017.08.006",
language = "English",
volume = "4.2017",
pages = "7122--7127",
journal = "Materials Today: Proceedings",
issn = "2214-7853",
publisher = "Elsevier",
number = "7, Part 2",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Laser Ultrasonic Thin Film Characterization of Si-Cu-Al-Cu Multi-Layered Stacks

AU - Grünwald, Eva

AU - Nuster, Robert

AU - Paltauf, Günther

AU - Maier, Thomas

AU - Wimmer-Teubenbacher, Robert

AU - Konetschnik, Ruth

AU - Kiener, Daniel

AU - Leitgeb, Verena

AU - Köck, Anton

AU - Brunner, Roland

PY - 2017/9/19

Y1 - 2017/9/19

KW - Laser Ultrasound

KW - Multi-Layered Systems

KW - Stack Charakterization

KW - Thin Film Characterization

UR - http://www.scopus.com/inward/record.url?scp=85029477173&partnerID=8YFLogxK

U2 - 10.1016/j.matpr.2017.08.006

DO - 10.1016/j.matpr.2017.08.006

M3 - Article

AN - SCOPUS:85029477173

VL - 4.2017

SP - 7122

EP - 7127

JO - Materials Today: Proceedings

JF - Materials Today: Proceedings

SN - 2214-7853

IS - 7, Part 2

ER -