Finite element analysis of arbitrarily complex electronics devices

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Finite element analysis of arbitrarily complex electronics devices. / Gschwandl, Mario; Fuchs, Peter; Fellner, Klaus et al.
Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016. 2016. S. 497-500.

Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

Harvard

Gschwandl, M, Fuchs, P, Fellner, K, Antretter, T, Krivec, T & Tao, Q 2016, Finite element analysis of arbitrarily complex electronics devices. in Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016. S. 497-500.

APA

Gschwandl, M., Fuchs, P., Fellner, K., Antretter, T., Krivec, T., & Tao, Q. (2016). Finite element analysis of arbitrarily complex electronics devices. In Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016 (S. 497-500)

Vancouver

Gschwandl M, Fuchs P, Fellner K, Antretter T, Krivec T, Tao Q. Finite element analysis of arbitrarily complex electronics devices. in Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016. 2016. S. 497-500

Author

Gschwandl, Mario ; Fuchs, Peter ; Fellner, Klaus et al. / Finite element analysis of arbitrarily complex electronics devices. Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016. 2016. S. 497-500

Bibtex - Download

@inproceedings{3a424aa832154d129a0274cad21a3abc,
title = "Finite element analysis of arbitrarily complex electronics devices",
author = "Mario Gschwandl and Peter Fuchs and Klaus Fellner and Thomas Antretter and Thomas Krivec and Qi Tao",
year = "2016",
language = "English",
pages = "497--500",
booktitle = "Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Finite element analysis of arbitrarily complex electronics devices

AU - Gschwandl, Mario

AU - Fuchs, Peter

AU - Fellner, Klaus

AU - Antretter, Thomas

AU - Krivec, Thomas

AU - Tao, Qi

PY - 2016

Y1 - 2016

M3 - Conference contribution

SP - 497

EP - 500

BT - Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016

ER -