Finite element analysis of arbitrarily complex electronics devices
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Standard
Finite element analysis of arbitrarily complex electronics devices. / Gschwandl, Mario; Fuchs, Peter; Fellner, Klaus et al.
Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016. 2016. S. 497-500.
Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016. 2016. S. 497-500.
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Harvard
Gschwandl, M, Fuchs, P, Fellner, K, Antretter, T, Krivec, T & Tao, Q 2016, Finite element analysis of arbitrarily complex electronics devices. in Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016. S. 497-500.
APA
Gschwandl, M., Fuchs, P., Fellner, K., Antretter, T., Krivec, T., & Tao, Q. (2016). Finite element analysis of arbitrarily complex electronics devices. In Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016 (S. 497-500)
Vancouver
Gschwandl M, Fuchs P, Fellner K, Antretter T, Krivec T, Tao Q. Finite element analysis of arbitrarily complex electronics devices. in Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016. 2016. S. 497-500
Author
Bibtex - Download
@inproceedings{3a424aa832154d129a0274cad21a3abc,
title = "Finite element analysis of arbitrarily complex electronics devices",
author = "Mario Gschwandl and Peter Fuchs and Klaus Fellner and Thomas Antretter and Thomas Krivec and Qi Tao",
year = "2016",
language = "English",
pages = "497--500",
booktitle = "Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016",
}
RIS (suitable for import to EndNote) - Download
TY - GEN
T1 - Finite element analysis of arbitrarily complex electronics devices
AU - Gschwandl, Mario
AU - Fuchs, Peter
AU - Fellner, Klaus
AU - Antretter, Thomas
AU - Krivec, Thomas
AU - Tao, Qi
PY - 2016
Y1 - 2016
M3 - Conference contribution
SP - 497
EP - 500
BT - Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016
ER -
