Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics

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Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics. / Peng, Chongnan; Tao, Qi; Krivec, Thomas et al.
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, 2024. (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

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Harvard

Peng, C, Tao, Q, Krivec, T, Casas, G, Latorre, S, Antretter, T, Macher, J & Fuchs, P 2024, Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics. in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024, Institute of Electrical and Electronics Engineers, 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024, Catania, Italien, 7/04/24. https://doi.org/10.1109/EuroSimE60745.2024.10491467

APA

Peng, C., Tao, Q., Krivec, T., Casas, G., Latorre, S., Antretter, T., Macher, J., & Fuchs, P. (2024). Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics. In 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE60745.2024.10491467

Vancouver

Peng C, Tao Q, Krivec T, Casas G, Latorre S, Antretter T et al. Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics. in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers. 2024. (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024). doi: 10.1109/EuroSimE60745.2024.10491467

Author

Peng, Chongnan ; Tao, Qi ; Krivec, Thomas et al. / Exploring the Impact of Laser Drilling on Material Thermal Decomposition : A Computational Study Using KratosMultiphysics. 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, 2024. (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

Bibtex - Download

@inproceedings{8f978e4f07854644b6532f35c1862569,
title = "Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics",
keywords = "KratosMultiophysics, laser drilling, PCB, Prout-Tompkins model",
author = "Chongnan Peng and Qi Tao and Thomas Krivec and Guillermo Casas and Salvador Latorre and Thomas Antretter and Johannes Macher and Peter Fuchs",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 ; Conference date: 07-04-2024 Through 10-04-2024",
year = "2024",
doi = "10.1109/EuroSimE60745.2024.10491467",
language = "English",
series = "2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024",
publisher = "Institute of Electrical and Electronics Engineers",
booktitle = "2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024",
address = "United States",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Exploring the Impact of Laser Drilling on Material Thermal Decomposition

T2 - 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024

AU - Peng, Chongnan

AU - Tao, Qi

AU - Krivec, Thomas

AU - Casas, Guillermo

AU - Latorre, Salvador

AU - Antretter, Thomas

AU - Macher, Johannes

AU - Fuchs, Peter

N1 - Publisher Copyright: © 2024 IEEE.

PY - 2024

Y1 - 2024

KW - KratosMultiophysics

KW - laser drilling

KW - PCB

KW - Prout-Tompkins model

UR - http://www.scopus.com/inward/record.url?scp=85191174251&partnerID=8YFLogxK

U2 - 10.1109/EuroSimE60745.2024.10491467

DO - 10.1109/EuroSimE60745.2024.10491467

M3 - Conference contribution

AN - SCOPUS:85191174251

T3 - 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024

BT - 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024

PB - Institute of Electrical and Electronics Engineers

Y2 - 7 April 2024 through 10 April 2024

ER -

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