Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, 2024. (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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TY - GEN
T1 - Exploring the Impact of Laser Drilling on Material Thermal Decomposition
T2 - 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024
AU - Peng, Chongnan
AU - Tao, Qi
AU - Krivec, Thomas
AU - Casas, Guillermo
AU - Latorre, Salvador
AU - Antretter, Thomas
AU - Macher, Johannes
AU - Fuchs, Peter
N1 - Publisher Copyright: © 2024 IEEE.
PY - 2024
Y1 - 2024
KW - KratosMultiophysics
KW - laser drilling
KW - PCB
KW - Prout-Tompkins model
UR - http://www.scopus.com/inward/record.url?scp=85191174251&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE60745.2024.10491467
DO - 10.1109/EuroSimE60745.2024.10491467
M3 - Conference contribution
AN - SCOPUS:85191174251
T3 - 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024
BT - 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024
PB - Institute of Electrical and Electronics Engineers
Y2 - 7 April 2024 through 10 April 2024
ER -
