Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

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Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers. / Gschwandl, Mario; Frewein, Markus; Fuchs, Peter Filipp et al.
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 2019. 8660763 (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).

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Harvard

Gschwandl, M, Frewein, M, Fuchs, PF, Antretter, T, Pinter, G & Novak, P 2019, Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers. in EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging., 8660763, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, Institute of Electrical and Electronics Engineers, 20th International Conference on Electronic Materials and Packaging, EMAP 2018, Clear Water Bay, Hong Kong, 17/12/18. https://doi.org/10.1109/EMAP.2018.8660763

APA

Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G., & Novak, P. (2019). Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers. In EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging Artikel 8660763 (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EMAP.2018.8660763

Vancouver

Gschwandl M, Frewein M, Fuchs PF, Antretter T, Pinter G, Novak P. Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers. in EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers. 2019. 8660763. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging). doi: 10.1109/EMAP.2018.8660763

Author

Gschwandl, Mario ; Frewein, Markus ; Fuchs, Peter Filipp et al. / Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers. EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 2019. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).

Bibtex - Download

@inproceedings{9589af8d912a4773824d5fe699b6a090,
title = "Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers",
author = "Mario Gschwandl and Markus Frewein and Fuchs, {Peter Filipp} and Thomas Antretter and Gerald Pinter and Philipp Novak",
year = "2019",
month = mar,
day = "5",
doi = "10.1109/EMAP.2018.8660763",
language = "English",
isbn = "9781538656426",
series = "EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging",
publisher = "Institute of Electrical and Electronics Engineers",
booktitle = "EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging",
address = "United States",
note = "20th International Conference on Electronic Materials and Packaging, EMAP 2018 ; Conference date: 17-12-2018 Through 20-12-2018",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

AU - Gschwandl, Mario

AU - Frewein, Markus

AU - Fuchs, Peter Filipp

AU - Antretter, Thomas

AU - Pinter, Gerald

AU - Novak, Philipp

PY - 2019/3/5

Y1 - 2019/3/5

UR - http://www.scopus.com/inward/record.url?scp=85063882073&partnerID=8YFLogxK

UR - https://pure.unileoben.ac.at/portal/en/publications/evaluation-of-digital-image-correlation-techniques-for-the-determination-of-coefficients-of-thermal-expansion-for-thin-reinforced-polymers(9589af8d-912a-4773-824d-5fe699b6a090).html

U2 - 10.1109/EMAP.2018.8660763

DO - 10.1109/EMAP.2018.8660763

M3 - Conference contribution

AN - SCOPUS:85063882073

SN - 9781538656426

T3 - EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging

BT - EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging

PB - Institute of Electrical and Electronics Engineers

T2 - 20th International Conference on Electronic Materials and Packaging, EMAP 2018

Y2 - 17 December 2018 through 20 December 2018

ER -

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