Enhanced Ti0.84Ta0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers

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Enhanced Ti0.84Ta0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers. / Mühlbacher, Marlene; Greczynski, Grzegorz; Sartory, Bernhard et al.
in: Scientific reports (London : Nature Publishing Group), 2018, S. 1-9.

Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

Harvard

Mühlbacher, M, Greczynski, G, Sartory, B, Schalk, N, Lu, J, Petrov, I, Greene, JE, Hultman, L & Mitterer, C 2018, 'Enhanced Ti0.84Ta0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers', Scientific reports (London : Nature Publishing Group), S. 1-9. https://doi.org/10.1038/s41598-018-23782-9

APA

Mühlbacher, M., Greczynski, G., Sartory, B., Schalk, N., Lu, J., Petrov, I., Greene, J. E., Hultman, L., & Mitterer, C. (2018). Enhanced Ti0.84Ta0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers. Scientific reports (London : Nature Publishing Group), 1-9. https://doi.org/10.1038/s41598-018-23782-9

Vancouver

Mühlbacher M, Greczynski G, Sartory B, Schalk N, Lu J, Petrov I et al. Enhanced Ti0.84Ta0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers. Scientific reports (London : Nature Publishing Group). 2018;1-9. doi: 10.1038/s41598-018-23782-9

Author

Mühlbacher, Marlene ; Greczynski, Grzegorz ; Sartory, Bernhard et al. / Enhanced Ti0.84Ta0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers. in: Scientific reports (London : Nature Publishing Group). 2018 ; S. 1-9.

Bibtex - Download

@article{3269fa4c666b495aae9dbb8c7171a8a5,
title = "Enhanced Ti0.84Ta0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers",
author = "Marlene M{\"u}hlbacher and Grzegorz Greczynski and Bernhard Sartory and Nina Schalk and Jun Lu and Ivan Petrov and J.E. Greene and Lars Hultman and Christian Mitterer",
year = "2018",
doi = "10.1038/s41598-018-23782-9",
language = "English",
pages = "1--9",
journal = "Scientific reports (London : Nature Publishing Group)",
issn = "2045-2322",
publisher = "Nature Publishing Group",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Enhanced Ti0.84Ta0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers

AU - Mühlbacher, Marlene

AU - Greczynski, Grzegorz

AU - Sartory, Bernhard

AU - Schalk, Nina

AU - Lu, Jun

AU - Petrov, Ivan

AU - Greene, J.E.

AU - Hultman, Lars

AU - Mitterer, Christian

PY - 2018

Y1 - 2018

U2 - 10.1038/s41598-018-23782-9

DO - 10.1038/s41598-018-23782-9

M3 - Article

SP - 1

EP - 9

JO - Scientific reports (London : Nature Publishing Group)

JF - Scientific reports (London : Nature Publishing Group)

SN - 2045-2322

ER -

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