Critical thickness for GaN thin film on AlN substrate

Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

Standard

Critical thickness for GaN thin film on AlN substrate. / Coppeta, R.A.; Ceric, H; Holec, David et al.
Integrated Reliability Workshop Final Report (IRW), 2013 IEEE International. 2013. S. 133-136.

Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

Harvard

Coppeta, RA, Ceric, H, Holec, D & Grasser, T 2013, Critical thickness for GaN thin film on AlN substrate. in Integrated Reliability Workshop Final Report (IRW), 2013 IEEE International. S. 133-136. https://doi.org/10.1109/IIRW.2013.6804177

APA

Coppeta, R. A., Ceric, H., Holec, D., & Grasser, T. (2013). Critical thickness for GaN thin film on AlN substrate. In Integrated Reliability Workshop Final Report (IRW), 2013 IEEE International (S. 133-136) https://doi.org/10.1109/IIRW.2013.6804177

Vancouver

Coppeta RA, Ceric H, Holec D, Grasser T. Critical thickness for GaN thin film on AlN substrate. in Integrated Reliability Workshop Final Report (IRW), 2013 IEEE International. 2013. S. 133-136 doi: 10.1109/IIRW.2013.6804177

Author

Coppeta, R.A. ; Ceric, H ; Holec, David et al. / Critical thickness for GaN thin film on AlN substrate. Integrated Reliability Workshop Final Report (IRW), 2013 IEEE International. 2013. S. 133-136

Bibtex - Download

@inproceedings{b1241c0559ae4f76bac82c4b76215b6c,
title = "Critical thickness for GaN thin film on AlN substrate",
author = "R.A. Coppeta and H Ceric and David Holec and T. Grasser",
year = "2013",
doi = "10.1109/IIRW.2013.6804177",
language = "English",
pages = "133--136",
booktitle = "Integrated Reliability Workshop Final Report (IRW), 2013 IEEE International",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Critical thickness for GaN thin film on AlN substrate

AU - Coppeta, R.A.

AU - Ceric, H

AU - Holec, David

AU - Grasser, T.

PY - 2013

Y1 - 2013

U2 - 10.1109/IIRW.2013.6804177

DO - 10.1109/IIRW.2013.6804177

M3 - Conference contribution

SP - 133

EP - 136

BT - Integrated Reliability Workshop Final Report (IRW), 2013 IEEE International

ER -