Conventional TEM Investigation of the FIB Damage in Copper
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Standard
Conventional TEM Investigation of the FIB Damage in Copper. / Kiener, Daniel; Jörg, Thomas; Rester, Martin et al.
Microscopy Conference, International Forum for Advanced Microscopy. 2007. S. 100-101.
Microscopy Conference, International Forum for Advanced Microscopy. 2007. S. 100-101.
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Harvard
Kiener, D, Jörg, T, Rester, M, Motz, C & Dehm, G 2007, Conventional TEM Investigation of the FIB Damage in Copper. in Microscopy Conference, International Forum for Advanced Microscopy. S. 100-101.
APA
Kiener, D., Jörg, T., Rester, M., Motz, C., & Dehm, G. (2007). Conventional TEM Investigation of the FIB Damage in Copper. In Microscopy Conference, International Forum for Advanced Microscopy (S. 100-101)
Vancouver
Kiener D, Jörg T, Rester M, Motz C, Dehm G. Conventional TEM Investigation of the FIB Damage in Copper. in Microscopy Conference, International Forum for Advanced Microscopy. 2007. S. 100-101
Author
Bibtex - Download
@inproceedings{7bb17192d11a4904b5ad1ff05b68f4c6,
title = "Conventional TEM Investigation of the FIB Damage in Copper",
author = "Daniel Kiener and Thomas J{\"o}rg and Martin Rester and Christian Motz and Gerhard Dehm",
year = "2007",
language = "English",
pages = "100--101",
booktitle = "Microscopy Conference, International Forum for Advanced Microscopy",
}
RIS (suitable for import to EndNote) - Download
TY - GEN
T1 - Conventional TEM Investigation of the FIB Damage in Copper
AU - Kiener, Daniel
AU - Jörg, Thomas
AU - Rester, Martin
AU - Motz, Christian
AU - Dehm, Gerhard
PY - 2007
Y1 - 2007
M3 - Conference contribution
SP - 100
EP - 101
BT - Microscopy Conference, International Forum for Advanced Microscopy
ER -
