Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior

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Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior. / Du, Chaowei; Soeler, Rafael; Völker, Bernhard et al.
in: Materialia, Jahrgang 8.2019, 100503, 01.12.2019.

Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

Harvard

Du, C, Soeler, R, Völker, B, Matoy, K, Zechner, J, Langer, G, Reisinger, M, Todt, J, Kirchlechner, C & Dehm, G 2019, 'Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior', Materialia, Jg. 8.2019, 100503. https://doi.org/10.1016/j.mtla.2019.100503

APA

Du, C., Soeler, R., Völker, B., Matoy, K., Zechner, J., Langer, G., Reisinger, M., Todt, J., Kirchlechner, C., & Dehm, G. (2019). Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior. Materialia, 8.2019, Artikel 100503. https://doi.org/10.1016/j.mtla.2019.100503

Vancouver

Du C, Soeler R, Völker B, Matoy K, Zechner J, Langer G et al. Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior. Materialia. 2019 Dez 1;8.2019:100503. Epub 2019 Okt 10. doi: 10.1016/j.mtla.2019.100503

Author

Du, Chaowei ; Soeler, Rafael ; Völker, Bernhard et al. / Au–Sn solders applied in transient liquid phase bonding : Microstructure and mechanical behavior. in: Materialia. 2019 ; Jahrgang 8.2019.

Bibtex - Download

@article{7f340aa4833542f69465b4bcef7e6968,
title = "Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior",
keywords = "Au–Sn solder, Fracture toughness, Micro-bending, Micro-cantilever testing",
author = "Chaowei Du and Rafael Soeler and Bernhard V{\"o}lker and Kurt Matoy and Johannes Zechner and Gregor Langer and Michael Reisinger and Juraj Todt and Christoph Kirchlechner and Gerhard Dehm",
year = "2019",
month = dec,
day = "1",
doi = "10.1016/j.mtla.2019.100503",
language = "English",
volume = "8.2019",
journal = "Materialia",
issn = "2589-1529",
publisher = "Elsevier",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Au–Sn solders applied in transient liquid phase bonding

T2 - Microstructure and mechanical behavior

AU - Du, Chaowei

AU - Soeler, Rafael

AU - Völker, Bernhard

AU - Matoy, Kurt

AU - Zechner, Johannes

AU - Langer, Gregor

AU - Reisinger, Michael

AU - Todt, Juraj

AU - Kirchlechner, Christoph

AU - Dehm, Gerhard

PY - 2019/12/1

Y1 - 2019/12/1

KW - Au–Sn solder

KW - Fracture toughness

KW - Micro-bending

KW - Micro-cantilever testing

UR - http://www.scopus.com/inward/record.url?scp=85074214840&partnerID=8YFLogxK

U2 - 10.1016/j.mtla.2019.100503

DO - 10.1016/j.mtla.2019.100503

M3 - Article

AN - SCOPUS:85074214840

VL - 8.2019

JO - Materialia

JF - Materialia

SN - 2589-1529

M1 - 100503

ER -

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