Analyzing Thermal Conductivity of Polyethylene‐Based Compounds Filled with Copper

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

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Analyzing Thermal Conductivity of Polyethylene‐Based Compounds Filled with Copper. / Weingrill, Helena; Hohenauer, Wolfgang; Resch-Fauster, Katharina et al.
in: Macromolecular materials and engineering, Jahrgang 304.2019, Nr. 4, 1800644, 09.01.2019.

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

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@article{85b8eddeaab74bd59cf6edf5cdb98356,
title = "Analyzing Thermal Conductivity of Polyethylene‐Based Compounds Filled with Copper",
abstract = "The thermal conductivity (TC) of different polymeric materials is measured via four commercially available testing devices: TPS2500S by Hot Disk (Hot Disk), Transient Hot Bridge (THB) by Linseis, the Laser Flash Analysis (LFA) by NETZSCH, and the DTC‐300 by TA Instruments. The investigated materials include high‐density polyethylene (HDPE) and linear low‐density polyethylene (LLDPE) which are analyzed as received and after being compounded with copper particles. The filler geometry and ratio are varied systematically. Major differences in the TC generated by the different measurement methods are revealed and analyzed in detail. Moreover, material‐induced impacts on the TC as well as technology‐induced impacts on the TC are outlined comprehensively.",
author = "Helena Weingrill and Wolfgang Hohenauer and Katharina Resch-Fauster and Christoph Zauner",
year = "2019",
month = jan,
day = "9",
doi = "10.1002/mame.201800644",
language = "English",
volume = "304.2019",
journal = "Macromolecular materials and engineering",
issn = "1438-7492",
publisher = "Wiley-VCH ",
number = "4",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Analyzing Thermal Conductivity of Polyethylene‐Based Compounds Filled with Copper

AU - Weingrill, Helena

AU - Hohenauer, Wolfgang

AU - Resch-Fauster, Katharina

AU - Zauner, Christoph

PY - 2019/1/9

Y1 - 2019/1/9

N2 - The thermal conductivity (TC) of different polymeric materials is measured via four commercially available testing devices: TPS2500S by Hot Disk (Hot Disk), Transient Hot Bridge (THB) by Linseis, the Laser Flash Analysis (LFA) by NETZSCH, and the DTC‐300 by TA Instruments. The investigated materials include high‐density polyethylene (HDPE) and linear low‐density polyethylene (LLDPE) which are analyzed as received and after being compounded with copper particles. The filler geometry and ratio are varied systematically. Major differences in the TC generated by the different measurement methods are revealed and analyzed in detail. Moreover, material‐induced impacts on the TC as well as technology‐induced impacts on the TC are outlined comprehensively.

AB - The thermal conductivity (TC) of different polymeric materials is measured via four commercially available testing devices: TPS2500S by Hot Disk (Hot Disk), Transient Hot Bridge (THB) by Linseis, the Laser Flash Analysis (LFA) by NETZSCH, and the DTC‐300 by TA Instruments. The investigated materials include high‐density polyethylene (HDPE) and linear low‐density polyethylene (LLDPE) which are analyzed as received and after being compounded with copper particles. The filler geometry and ratio are varied systematically. Major differences in the TC generated by the different measurement methods are revealed and analyzed in detail. Moreover, material‐induced impacts on the TC as well as technology‐induced impacts on the TC are outlined comprehensively.

UR - http://www.scopus.com/inward/record.url?scp=85059660616&partnerID=8YFLogxK

U2 - 10.1002/mame.201800644

DO - 10.1002/mame.201800644

M3 - Article

VL - 304.2019

JO - Macromolecular materials and engineering

JF - Macromolecular materials and engineering

SN - 1438-7492

IS - 4

M1 - 1800644

ER -