Al-Cr-N thin film design for high temperature applications

Publikationen: Thesis / Studienabschlussarbeiten und HabilitationsschriftenDissertation

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Al-Cr-N thin film design for high temperature applications. / Willmann, Herbert.
2007.

Publikationen: Thesis / Studienabschlussarbeiten und HabilitationsschriftenDissertation

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@phdthesis{7444095023ac4dcf93dc64fdd45e0747,
title = "Al-Cr-N thin film design for high temperature applications",
abstract = "In this PhD thesis the microstructural design of AlxCr1-xN thin films (0 0.7, however, in this work the cubic structure could be stabilized up to x=0.81 by epitaxial growth. The addition of Al improves the oxidation resistance and has a stabilizing effect on the Cr-N bonds. The onset of dissociation is shifted to temperatures >1000 °C where Al-Cr-N decomposes to form Cr via the intermediate step of Cr2N under the release of nitrogen. Polycrystalline Al0.68Cr0.32N films show precipitation hardening due to wurtzite AlN formation, however, causing reduced Cr-N bond stability. Suppressing precipitation by reduction of possible nucleation sites (i.e. single crystal films) or lower Al-content in the film results in a conserved hardness of 30 GPa up to 1000 °C.",
keywords = "Al-Cr-N, Cr-Al-N, STA, DSC, TGA, MS, XRD, HR-XRD, HT-XRD, TEM, STEM, thin film coating precipitation, decompositions, epitaxy, RSM, PVD, arc evaporiation, magnetron sputtering, Al-Cr-N, Cr-Al-N, STA, DSC, TGA, MS, TEM, XRD, Ausscheidung, Phasentransformation, Epitaxie, Schichtwachstum, D{\"u}nnschichttechnik, Lichtbogenverdampfung, Kathodenzerst{\"a}ubung",
author = "Herbert Willmann",
note = "no embargo",
year = "2007",
language = "English",

}

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TY - BOOK

T1 - Al-Cr-N thin film design for high temperature applications

AU - Willmann, Herbert

N1 - no embargo

PY - 2007

Y1 - 2007

N2 - In this PhD thesis the microstructural design of AlxCr1-xN thin films (0 0.7, however, in this work the cubic structure could be stabilized up to x=0.81 by epitaxial growth. The addition of Al improves the oxidation resistance and has a stabilizing effect on the Cr-N bonds. The onset of dissociation is shifted to temperatures >1000 °C where Al-Cr-N decomposes to form Cr via the intermediate step of Cr2N under the release of nitrogen. Polycrystalline Al0.68Cr0.32N films show precipitation hardening due to wurtzite AlN formation, however, causing reduced Cr-N bond stability. Suppressing precipitation by reduction of possible nucleation sites (i.e. single crystal films) or lower Al-content in the film results in a conserved hardness of 30 GPa up to 1000 °C.

AB - In this PhD thesis the microstructural design of AlxCr1-xN thin films (0 0.7, however, in this work the cubic structure could be stabilized up to x=0.81 by epitaxial growth. The addition of Al improves the oxidation resistance and has a stabilizing effect on the Cr-N bonds. The onset of dissociation is shifted to temperatures >1000 °C where Al-Cr-N decomposes to form Cr via the intermediate step of Cr2N under the release of nitrogen. Polycrystalline Al0.68Cr0.32N films show precipitation hardening due to wurtzite AlN formation, however, causing reduced Cr-N bond stability. Suppressing precipitation by reduction of possible nucleation sites (i.e. single crystal films) or lower Al-content in the film results in a conserved hardness of 30 GPa up to 1000 °C.

KW - Al-Cr-N

KW - Cr-Al-N

KW - STA

KW - DSC

KW - TGA

KW - MS

KW - XRD

KW - HR-XRD

KW - HT-XRD

KW - TEM

KW - STEM

KW - thin film coating precipitation

KW - decompositions

KW - epitaxy

KW - RSM

KW - PVD

KW - arc evaporiation

KW - magnetron sputtering

KW - Al-Cr-N

KW - Cr-Al-N

KW - STA

KW - DSC

KW - TGA

KW - MS

KW - TEM

KW - XRD

KW - Ausscheidung

KW - Phasentransformation

KW - Epitaxie

KW - Schichtwachstum

KW - Dünnschichttechnik

KW - Lichtbogenverdampfung

KW - Kathodenzerstäubung

M3 - Doctoral Thesis

ER -