Transient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Method
Research output: Contribution to journal › Article › Research › peer-review
Standard
In: Journal of the Electrochemical Society, Vol. 170.2023, No. 7, 072501, 04.07.2023.
Research output: Contribution to journal › Article › Research › peer-review
Harvard
APA
Vancouver
Author
Bibtex - Download
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Transient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Method
AU - Karimi Sibaki, Ebrahim
AU - Vakhrushev, Alexander
AU - Wu, Menghuai
AU - Ludwig, Andreas
AU - Bohacek, Jan
AU - Kharicha, Abdellah
PY - 2023/7/4
Y1 - 2023/7/4
N2 - A numerical model utilizing the volume of fluid (VOF) method is proposed to simulate the transient shape changes of the deposit front, considering the diffusion-limited electrodeposition process. Modeling equations are proposed to accurately handle transport phenomena in both electrolyte (fluid) and deposit (solid). Transient evolutions of field structures, including flow, concentration, electric current density, and electric potential, are computed considering electrodeposited copper bumps. Two cases, including single cavity and multiple cavities, are studied. Based on the modeling results, the maximum height of the hump and the thickness of the deposited layer in each consecutive cavity decreases going from upstream to downstream. Conversely, the location of the maximum height of the hump remains unchanged in all cavities. Results are validated against available experiments.
AB - A numerical model utilizing the volume of fluid (VOF) method is proposed to simulate the transient shape changes of the deposit front, considering the diffusion-limited electrodeposition process. Modeling equations are proposed to accurately handle transport phenomena in both electrolyte (fluid) and deposit (solid). Transient evolutions of field structures, including flow, concentration, electric current density, and electric potential, are computed considering electrodeposited copper bumps. Two cases, including single cavity and multiple cavities, are studied. Based on the modeling results, the maximum height of the hump and the thickness of the deposited layer in each consecutive cavity decreases going from upstream to downstream. Conversely, the location of the maximum height of the hump remains unchanged in all cavities. Results are validated against available experiments.
U2 - 10.1149/1945-7111/ace133
DO - 10.1149/1945-7111/ace133
M3 - Article
VL - 170.2023
JO - Journal of the Electrochemical Society
JF - Journal of the Electrochemical Society
SN - 0013-4651
IS - 7
M1 - 072501
ER -
