Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts
Research output: Contribution to conference › Poster › Research
Standard
Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts. / Thalhamer, Andreas; Rossegger, Elisabeth; Hasil, S. et al.
2023. Poster session presented at 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Graz, Austria.
2023. Poster session presented at 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Graz, Austria.
Research output: Contribution to conference › Poster › Research
Harvard
Thalhamer, A, Rossegger, E, Hasil, S, Hrbinič, K, Feigl, V, Pfost, M & Fuchs, PF 2023, 'Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts', 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Graz, Austria, 16/04/23 - 19/04/23.
APA
Thalhamer, A., Rossegger, E., Hasil, S., Hrbinič, K., Feigl, V., Pfost, M., & Fuchs, P. F. (2023). Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts. Poster session presented at 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Graz, Austria.
Vancouver
Thalhamer A, Rossegger E, Hasil S, Hrbinič K, Feigl V, Pfost M et al.. Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts. 2023. Poster session presented at 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Graz, Austria.
Author
Bibtex - Download
@conference{79d72aab6179409b999af6236f94636f,
title = "Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts",
author = "Andreas Thalhamer and Elisabeth Rossegger and S. Hasil and Katja Hrbini{\v c} and Viktoria Feigl and M. Pfost and P.F. Fuchs",
year = "2023",
language = "English",
note = "24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 ; Conference date: 16-04-2023 Through 19-04-2023",
}
RIS (suitable for import to EndNote) - Download
TY - CONF
T1 - Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts
AU - Thalhamer, Andreas
AU - Rossegger, Elisabeth
AU - Hasil, S.
AU - Hrbinič, Katja
AU - Feigl, Viktoria
AU - Pfost, M.
AU - Fuchs, P.F.
PY - 2023
Y1 - 2023
M3 - Poster
T2 - 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
Y2 - 16 April 2023 through 19 April 2023
ER -
