Research output

  1. 2014
  2. Published

    Recovery of electrical resistance in copper films on polyethylene terephthalate subjected to a tensile strain

    Glushko, O., Marx, V. M., Kirchlechner, C., Zizak, I. & Cordill, M. J., 2014, In: Thin solid films. 552, p. 141-145

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published

    Residual Stress Investigations in Thin Film Systems: Experiment and Simulation

    Kozic, D., Treml, R., Sartory, B., Schöngrundner, R., Kiener, D., Antretter, T., Gänser, H-P. & Brunner, R., 2014.

    Research output: Contribution to conferencePosterResearchpeer-review

  4. Published

    Reversible cyclic deformation mechanism of gold nanowires by twinning–detwinning transition evidenced from in situ TEM

    Lee, S., Im, J., Yoo, Y., Bitzek, E., Kiener, D., Richter, G., Kim, B. & Oh, S. H., 2014, In: Nature Communications. 5, p. 1-10

    Research output: Contribution to journalArticleResearchpeer-review

  5. Published

    The Influence of Grain Boundaries and Loading Conditions on the Deformation Behavior of bcc-and fcc-Metals

    Maier, V., Scherwitzel, D. & Kiener, D., 2014.

    Research output: Contribution to conferencePosterResearchpeer-review

  6. Published
  7. Published

    The influence of strain rate and critical temperature on the deformation behavior of W, V and Cr

    Fritz, R., Riegelnegg, E., Treml, R., Alfreider, M., Maier, V. & Kiener, D., 2014.

    Research output: Contribution to conferencePosterResearchpeer-review

  8. Published

    Thermodynamics-based computational Approach to Al-Cu Alloys: Grain Refinement

    Li, J., Promer, C., Jahn, A., Oberdorfer, B., Wurster, S., Martin, F. & Schumacher, P., 2014, Shape Casting: 5th International Symposium 2014. p. 77-87

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  9. 2013
  10. Published

    Fertigung von Elektronik in Europa im Brennpunkt

    Kiener, D., 24 May 2013, In: Kleine Zeitung / Steiermark - Leoben und rund um den Erzberg.

    Research output: Contribution to journalArticleTransfer

  11. Published

    A brief summary of the progress on the EFDA tungsten materials program

    Rieth, M., Dudarev, S. L., Gonzalez De Vicente, S. M., Aktaa, J., Ahlgren, T., Antusch, S., Armstrong, D. E. J., Balden, M., Baluc, N., Barthe, M. F., Basuki, W. W., Battabyal, M., Becquart, C. S., Blagoeva, D., Boldyryeva, H., Brinkmann, J., Celino, M., Ciupinski, L., Correia, J. B., De Backer, A., & 51 othersDomain, C., Gaganidze, E., Garcia-Rosales, C., Gibson, J., Gilbert, M. R., Giusepponi, S., Gludovatz, B., Greuner, H., Heinola, K., Höschen, T., Hoffmann, A., Holstein, N., Koch, F., Krauss, W., Li, H., Lindig, S., Linke, J., Linsmeier, C., Lopez-Ruiz, P., Maier, H., Matejicek, J., Mishra, T. P., Muhammed, M., Munoz, A., Muzyk, M., Nordlund, K., Nguyen-Manh, D., Opschoor, J., Ordas, N., Palacios, T., Pintsuk, G., Pippan, R., Reiser, J., Riesch, J., Roberts, S. G., Romaner, L., Rosiński, M., Sanchez, M., Schulmeyer, W., Traxler, H., Urena, A., Van Der Laan, J. G., Veleva, L., Wahlberg, S., Walter, M., Weber, T., Weitkamp, T., Wurster, S., Yar, M. A., You, J. H. & Zivelonghi, A., 18 Apr 2013, In: Journal of nuclear materials. 442, 1-3 SUPPL.1

    Research output: Contribution to journalArticleResearchpeer-review

  12. Published

    Adhesion measurements of printed circuit boards using four point bending

    Cordill, M., 2013.

    Research output: Contribution to conferencePosterResearchpeer-review