Research output

  1. 2021
  2. Published

    Ductile failure modelling in pre-cracked solids using coupled fracture locus theory

    Baltic, S., Magnien, J., Kolitsch, S., Gänser, H-P., Antretter, T. & Hammer, R., Jul 2021, In: Engineering Fracture Mechanics. 252.2021, July, 13 p., 107845.

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published
  4. Published

    Evaluation of Cement-Casing & Cement-Rock Bond Integrity during Well Operations.

    Lamik, A., Thonhauser, G., Ravi, K., Prohaska-Marchried, M., Pittino, G. & Antretter, T., 27 May 2021, p. 1-13. 13 p.

    Research output: Contribution to conferencePaperpeer-review

  5. Published

    A new development of four-point method to measure the electrical resistivity in situ during plastic deformation

    Saberi, S., Stockinger, M., Stoeckl, C., Buchmayr, B., Weiss, H., Afsharnia, R. & Hartl, K., 11 May 2021, In: Measurement. 180.2021, August, 109547.

    Research output: Contribution to journalArticleResearchpeer-review

  6. Published

    Machine learning assisted calibration of a ductile fracture locus model

    Baltic, S., Asadzadeh, M. Z., Hammer, P., Magnien, J., Gänser, H. P., Antretter, T. & Hammer, R., May 2021, In: Materials and Design. 203.2021, May, 15 p., 109604.

    Research output: Contribution to journalArticleResearchpeer-review

  7. Published

    Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

    Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  8. Published

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  9. Published

    Analysis of shape, orientation and interface properties of Mo2C precipitates in Fe using ab-initio and finite element method calculations

    Leitner, S., Scheiber, D., Dengg, T., Spitaler, J., Antretter, T. & Ecker, W., 1 Feb 2021, In: Acta materialia. 204.2021, 1 February, 11 p., 116478.

    Research output: Contribution to journalArticleResearchpeer-review

  10. Published

    Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates

    Yalagach, M., Fuchs, P., Antretter, T., Feuchter, M., Tao, Q. & Weber, M., 29 Jan 2021, In: Sensors & transducers. 248.2021, 1, 9 p.

    Research output: Contribution to journalArticleResearchpeer-review

  11. Published

    Fabrication of 3D metal-ceramic (Al-AlN) architectures using laser-powder bed fusion process

    Wallis, C., Buchmayr, B., Bermejo, R. & Supancic, P., 2021, In: Additive Manufacturing. 38.2021, February, 14 p., 101799.

    Research output: Contribution to journalArticleResearchpeer-review

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