Research output

  1. 2021
  2. Published
  3. Published

    Evaluation of Cement-Casing & Cement-Rock Bond Integrity during Well Operations.

    Lamik, A., Thonhauser, G., Ravi, K., Prohaska-Marchried, M., Pittino, G. & Antretter, T., 27 May 2021, p. 1-13. 13 p.

    Research output: Contribution to conferencePaperpeer-review

  4. Published

    A new development of four-point method to measure the electrical resistivity in situ during plastic deformation

    Saberi, S., Stockinger, M., Stoeckl, C., Buchmayr, B., Weiss, H., Afsharnia, R. & Hartl, K., 11 May 2021, In: Measurement. 180.2021, August, 109547.

    Research output: Contribution to journalArticleResearchpeer-review

  5. Published

    Machine learning assisted calibration of a ductile fracture locus model

    Baltic, S., Asadzadeh, M. Z., Hammer, P., Magnien, J., Gänser, H. P., Antretter, T. & Hammer, R., May 2021, In: Materials and Design. 203.2021, May, 15 p., 109604.

    Research output: Contribution to journalArticleResearchpeer-review

  6. Published

    Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

    Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  7. Published

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  8. Published

    Effect of pressure and temperature on microstructure of self-assembled gradient AlxTi1−XN coatings

    Zalesak, J., Todt, J., Michalička, J., Sartory, B., Matko, I., Lessiak, M., Traxler, M., Weißenbacher, R., Pitonak, R., Gammer, C. & Keckes, J., 3 Apr 2021, In: Coatings. 11.2021, 4, 15 p., 416.

    Research output: Contribution to journalArticleResearchpeer-review

  9. Published

    Predicting strength of Finnish birch veneers based on three different failure criteria

    Pramreiter, M., Bodner, S. C., Keckes, J., Stadlmann, A., Feist, F., Baumann, G., Maawad, E. & Müller, U., 15 Mar 2021, In: Holzforschung. 75.2021, 9, p. 847-856 10 p.

    Research output: Contribution to journalArticleResearchpeer-review

  10. Published

    Ion irradiation-induced localized stress relaxation in W thin film revealed by cross-sectional X-ray nanodiffraction

    Hlushko, K., Mackova, A., Zalesak, J., Burghammer, M., Davydok, A., Krywka, C., Daniel, R., Keckes, J. & Todt, J., 7 Feb 2021, In: Thin solid films. 722.2021, 31 March, 6 p., 138571.

    Research output: Contribution to journalArticleResearchpeer-review

  11. Published

    Correlative cross-sectional characterization of nitrided, carburized and shot-peened steels: synchrotron micro-X-ray diffraction analysis of stress, microstructure and phase gradients

    Bodner, S. C., Meindlhumer, M., Ziegelwanger, T., Winklmayr, H., Hatzenbichler, T., Schindelbacher, C., Sartory, B., Krobath, M., Ecker, W., Schell, N. & Keckes, J., 3 Feb 2021, In: Journal of Materials Research and Technology. 11.2021, March-April, p. 1396-1410 15 p.

    Research output: Contribution to journalArticleResearchpeer-review

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