Research output

  1. 2021
  2. Published

    Rock bolt having sensor for measuring mechanical tension

    Feiel, S., Kern, W., Griesser, T. & Moser, P., 26 Aug 2021, IPC No. E21D 21/ 02 A I, Patent No. AU2020223803, Priority date 6 Feb 2020, Priority No. WO2020EP53028

    Research output: Patent

  3. Published

    Ductile failure modelling in pre-cracked solids using coupled fracture locus theory

    Baltic, S., Magnien, J., Kolitsch, S., Gänser, H-P., Antretter, T. & Hammer, R., Jul 2021, In: Engineering Fracture Mechanics. 252.2021, July, 13 p., 107845.

    Research output: Contribution to journalArticleResearchpeer-review

  4. Published

    STABILE WÄSSRIGE ZUSAMMENSETZUNGEN UMFASSEND CHINONE UND DEREN VERWENDUNG IN REDOX-FLOW BATTERIEN

    Schlemmer, W., Spirk, S., Kern, W., Nothdurft, P. & Tayli, M., 3 Jun 2021, IPC No. H01M 8/ 18 A I, Patent No. WO2021105322, Priority date 28 Nov 2019, Priority No. EP20190212222

    Research output: Patent

  5. Published
  6. Published

    Stabile wässrige Zusammensetzungen umfassend Chinone und deren Verwendung in Redox-Flow-Batterien

    Schlemmer, W., Spirk, S., Kern, W., Nothdurft, P. & Tayli, M., 2 Jun 2021, IPC No. H01M 8/ 18 A I, Patent No. EP3828975, 28 Nov 2019, Priority date 28 Nov 2019

    Research output: Patent

  7. Published

    Evaluation of Cement-Casing & Cement-Rock Bond Integrity during Well Operations.

    Lamik, A., Thonhauser, G., Ravi, K., Prohaska-Marchried, M., Pittino, G. & Antretter, T., 27 May 2021, p. 1-13. 13 p.

    Research output: Contribution to conferencePaperpeer-review

  8. Published

    Machine learning assisted calibration of a ductile fracture locus model

    Baltic, S., Asadzadeh, M. Z., Hammer, P., Magnien, J., Gänser, H. P., Antretter, T. & Hammer, R., May 2021, In: Materials and Design. 203.2021, May, 15 p., 109604.

    Research output: Contribution to journalArticleResearchpeer-review

  9. Published

    Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

    Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  10. Published

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  11. Published
Previous 12 3 4 5 6 7 8 9 ...65 Next