Research output

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  1. 2023
  2. Published

    Prozessoptimierung mittels multiphysikalischer Modellierung des Widerstandspunktschweißens

    Prabitz, K., Antretter, T., Schubert, H., Hilpert, B., Gruber, M., Sierlinger, R., Polcik, P. & Ecker, W., 2023, XLI. Verformungskundliches Kolloquium.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  3. Published

    Simulation of the mechanical response of the individual intermetallic phases in multi-phase γ titanium aluminides

    Seligmann, B., Spörk-Erdely, P. & Antretter, T., 2023.

    Research output: Contribution to conference › Poster › Research

  4. Accepted/In press

    Single-Step Kinetic Predictions Based on a Constructed Isoconversional State Diagram

    Tao, Q., Krivec, T. & Kern, W., 2023, (Accepted/In press) In: Macromolecular Theory and Simulations. 2024, ??? Stand: 15. Februar, p. ??? 12 p., 2300066.

    Research output: Contribution to journal › Article › Research › peer-review

  5. Published

    Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

    Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M. & Fuchs, P., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  6. 2022
  7. Published

    A Technology-Enhanced ‘Assessment System for Teaching and Assessment using a Computer Algebra Kernel’ (STACK): The Best Contributions of 2022’s STACK Community Meeting at the Montanuniversitaet Leoben, Austria

    Orthaber, M. (Guest ed.), Antretter, T. (Guest ed.), Orthaber, M. & Antretter, T., 8 Dec 2022, In: International journal emerging technologies in learning : iJET. 2022, Vol. 17 No. 23

    Research output: Contribution to journal › Special issue › Research › peer-review

  8. Published

    Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., Dec 2022, In: Microelectronics Reliability. 139.2022, December, 9 p., 114799.

    Research output: Contribution to journal › Article › Research › peer-review

  9. Published

    A Bird’s-Eye View on Polymer-Based Hydrogen Carriers for Mobile Applications

    Sharifian, M., Kern, W. & Riess, G., 25 Oct 2022, In: Polymers. 14.2022, 21, 26 p., 4512.

    Research output: Contribution to journal › Review article › peer-review

  10. Published

    Anti-Adhesive Organosilane Coating Comprising Visibility on Demand

    Kern, W., Müller, M., Bandl, C., Krempl, N. & Kratzer, M., 24 Sept 2022, In: Polymers. 14.2022, 19, 20 p., 4006.

    Research output: Contribution to journal › Article › Research › peer-review

  11. E-pub ahead of print

    A new method for successful indirect bonding in relation to bond strength

    Wendl, T., Bandl, C., Kern, W., Wendl, B. & Proff, P., 24 Aug 2022, (E-pub ahead of print) In: Biomedical engineering = Biomedizinische Technik. 67.2022, 5, p. 403-410 8 p.

    Research output: Contribution to journal › Article › Research › peer-review

  12. Published

    Nano vs. recycling: a study of different fillers for thermosets

    Feuchter, M., Kern, W. & Sieberer, M., Jul 2022, EPF European Polymer Congress - Book of Abstracts. 1 ed. Prag, p. 272

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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