Research output

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2023
Published
Residual Stress Evolution in Low-Alloyed Steel at Three Different Length Scales
Leitner, S., Winter, G., Klarner, J., Antretter, T. & Ecker, W., 23 Mar 2023, In: Materials. 16.2023, 7, 17 p., 2568.
Research output: Contribution to journal › Article › Research › peer-review
Published
On the road towards understanding squats: residual stress state of rails
Gschwandl, T. J., Daves, W., Antretter, T., Bucher, C. & Künstner, D., 2023, In: Procedia Structural Integrity. 46, p. 17-23 7 p.
Research output: Contribution to journal › Conference article › peer-review
Published
Prozessoptimierung mittels multiphysikalischer Modellierung des Widerstandspunktschweißens
Prabitz, K., Antretter, T., Schubert, H., Hilpert, B., Gruber, M., Sierlinger, R., Polcik, P. & Ecker, W., 2023, XLI. Verformungskundliches Kolloquium.
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Published
Simulation of the mechanical response of the individual intermetallic phases in multi-phase γ titanium aluminides
Seligmann, B., Spörk-Erdely, P. & Antretter, T., 2023.
Research output: Contribution to conference › Poster › Research
Accepted/In press
Single-Step Kinetic Predictions Based on a Constructed Isoconversional State Diagram
Tao, Q., Krivec, T. & Kern, W., 2023, (Accepted/In press) In: Macromolecular Theory and Simulations. 2024, ??? Stand: 15. Februar, p. ??? 12 p., 2300066.
Research output: Contribution to journal › Article › Research › peer-review
Published
Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts
Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M. & Fuchs, P., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2022
Published
A Technology-Enhanced ‘Assessment System for Teaching and Assessment using a Computer Algebra Kernel’ (STACK): The Best Contributions of 2022’s STACK Community Meeting at the Montanuniversitaet Leoben, Austria
Orthaber, M. (Guest ed.), Antretter, T. (Guest ed.), Orthaber, M. & Antretter, T., 8 Dec 2022, In: International journal emerging technologies in learning : iJET. 2022, Vol. 17 No. 23
Research output: Contribution to journal › Special issue › Research › peer-review
Published
Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., Dec 2022, In: Microelectronics Reliability. 139.2022, December, 9 p., 114799.
Research output: Contribution to journal › Article › Research › peer-review
E-pub ahead of print
Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics
Gschwandl, M., Friedrich, B. E., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 4 May 2022, (E-pub ahead of print) In: Microelectronics Reliability. 133.2022, June, 9 p., 114537.
Research output: Contribution to journal › Article › Research › peer-review
Published
A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process
Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S. & Wolfberger, A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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Research Portal

Research output

Residual Stress Evolution in Low-Alloyed Steel at Three Different Length Scales

On the road towards understanding squats: residual stress state of rails

Prozessoptimierung mittels multiphysikalischer Modellierung des Widerstandspunktschweißens

Simulation of the mechanical response of the individual intermetallic phases in multi-phase γ titanium aluminides

Single-Step Kinetic Predictions Based on a Constructed Isoconversional State Diagram

Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

A Technology-Enhanced ‘Assessment System for Teaching and Assessment using a Computer Algebra Kernel’ (STACK): The Best Contributions of 2022’s STACK Community Meeting at the Montanuniversitaet Leoben, Austria

Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics

Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics

A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process

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