Research output

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  1. 2021
  2. Published

    Conveyor Belt Breakage Simulation: DEM-based bonded particle modelling technique to depict belt breakage in operating belt conveyors while transporting bulk materials.

    Fimbinger, E., 12 May 2021, Projektbroschüre der Bergbaukunde 2020. Leoben, p. 31 1 p.

    Research output: Chapter in Book/Report/Conference proceeding › Chapter › Research

  3. Published

    Multi-Physics DEM Simulation: Capabilities & features of the simulation software ThreeParticle/CAE as a powerful platform for virtual prototyping with complex bulk materials.

    Fimbinger, E. & Becker, A., 12 May 2021, Projektbroschüre der Bergbaukunde 2020. Leoben, p. 32 1 p.

    Research output: Chapter in Book/Report/Conference proceeding › Chapter › Research

  4. Published

    Machine learning assisted calibration of a ductile fracture locus model

    Baltic, S., Asadzadeh, M. Z., Hammer, P., Magnien, J., Gänser, H. P., Antretter, T. & Hammer, R., May 2021, In: Materials and Design. 203.2021, May, 15 p., 109604.

    Research output: Contribution to journal › Article › Research › peer-review

  5. Published

    Modelling Pasty Material Behaviour Using the Discrete Element Method

    Platzer, F. & Fimbinger, E., 26 Apr 2021, In: Multiscale science and engineering. 3.2021, 2, p. 119-128 10 p.

    Research output: Contribution to journal › Article › Research › peer-review

  6. Published

    Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

    Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  7. Published

    Excavation and Conveying for Lunar Missions: System developments for the two fundamental steps of the ISRU chain

    Hartlieb, P., Fimbinger, E., Höber, D. & Taschner, A., 19 Apr 2021.

    Research output: Contribution to conference › Poster › Research

  8. Published

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  9. Published

    Our Contribution to the NASA RASSOR Bucket Drum Design Challenge

    Weißenböck, S. & Fimbinger, E., 5 Feb 2021, In: Berg- und hüttenmännische Monatshefte : BHM. 166.2021, 2, p. 104-111 8 p.

    Research output: Contribution to journal › Article › Research › peer-review

  10. Published

    Analysis of shape, orientation and interface properties of Mo2C precipitates in Fe using ab-initio and finite element method calculations

    Leitner, S., Scheiber, D., Dengg, T., Spitaler, J., Antretter, T. & Ecker, W., 1 Feb 2021, In: Acta materialia. 204.2021, 1 February, 11 p., 116478.

    Research output: Contribution to journal › Article › Research › peer-review

  11. Published

    Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates

    Yalagach, M., Fuchs, P., Antretter, T., Feuchter, M., Tao, Q. & Weber, M., 29 Jan 2021, In: Sensors & transducers. 248.2021, 1, 9 p.

    Research output: Contribution to journal › Article › Research › peer-review

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