Research output

  1. 2021
  2. Published

    A new development of four-point method to measure the electrical resistivity in situ during plastic deformation

    Saberi, S., Stockinger, M., Stoeckl, C., Buchmayr, B., Weiss, H., Afsharnia, R. & Hartl, K., 11 May 2021, In: Measurement. 180.2021, August, 109547.

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published

    Planning and implementation of a digital shadow for the friction factor quantification of the ECAP process using grey box modeling approach and finite element analysis

    Schwarz, A., Stockinger, M. & Ralph, B. J., 4 May 2021, CIRP. Vol. 2020. p. 237 241 p. 99. ( Procedia CIRP).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  4. Published

    Machine learning assisted calibration of a ductile fracture locus model

    Baltic, S., Asadzadeh, M. Z., Hammer, P., Magnien, J., Gänser, H. P., Antretter, T. & Hammer, R., May 2021, In: Materials and Design. 203.2021, May, 15 p., 109604.

    Research output: Contribution to journalArticleResearchpeer-review

  5. Published

    Implementation of a Six-Layer Smart Factory Architecture with Special Focus on Transdisciplinary Engineering Education

    Ralph, B. J., Sorger, M., Schödinger, B., Schmölzer, H-J., Hartl, K. & Stockinger, M., 22 Apr 2021, In: Sensors. 21.2021, 9, 24 p., 2944.

    Research output: Contribution to journalArticleResearchpeer-review

  6. Published
  7. Published

    Theoretical and experimental investigations of mechanical vibrations of hot hammer forging

    Saberi, S., Fischer, J., Stockinger, M., Tikal, R. & Afsharnia, R., 20 Apr 2021, In: International Journal of Advanced Manufacturing Technology. 114.2021, 9-10, p. 3037-3045 9 p.

    Research output: Contribution to journalArticleResearchpeer-review

  8. Published

    Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

    Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  9. Published

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  10. Published

    Strength ranking for interfaces between a TiN hard coating and microstructural constituents of high speed steel determined by micromechanical testing

    Gsellmann, M., Klünsner, T., Mitterer, C., Krobath, M., Wurmshuber, M., Leitner, H., Ecker, W., Marsoner, S., Maier-Kiener, V., Kiener, D. & Ressel, G., 31 Mar 2021, In: Materials and Design. 204.2021, June, 11 p., 109690.

    Research output: Contribution to journalArticleResearchpeer-review

  11. Published

    Zr addition-dependent twin morphology evolution and strengthening response in nanostructured Al thin films

    Li, G. Y., Wang, Y. Q., Zuo, J. D., Zhang, M., He, C., Feng, X., Luan, J. H., Lu, Y., Zhang, J. Y., Cazottes, S., Kiener, D., Liu, G. & Sun, J., 19 Mar 2021, In: Materialia. 2021, 16, 1 p., 101076.

    Research output: Contribution to journalArticleResearchpeer-review

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