For Automated Tape Placement process, degree of bond varies with variation in process parameters and material. Interlaminar bond strength characterization is one of the most important criteria in determining the quality of bond between two layers of thermoplastic tapes. Depending on the bond strength achieved using different process parameters, a process window is defined. Based on the process window an iterative procedure is adopted to find optimum parameters to realize maximum bond strength. This paper aims to investigate the interlaminar bond strength of thermoplastic CF-PA6, during Automated Tape Placement process. A fairly new heating source, a pulsed light solution, i.e. a humm3TM system, which delivers uniform, highly controllable heat to the nip point is used. Experiments were conducted for different process parameters and results obtained using wedge peel test were analyzed. Results acquired help in assessing the material and the heating source in terms of capabilities and efficiency.