Novel temperature dependent tensile test of freestanding copper thin film structures
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| Translated title of the contribution | Novel temperature dependent tensile test of freestanding copper thin film structures |
|---|---|
| Original language | German |
| Pages (from-to) | 064702/1-064702/9 |
| Journal | Review of scientific instruments |
| Volume | Jun;(6) |
| DOIs | |
| Publication status | Published - 2012 |
