Modification of the Cu/W interface cohesion by segregation

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Modification of the Cu/W interface cohesion by segregation. / Bodlos, Rishi; Scheiber, Daniel; Spitaler, Jürgen et al.
In: Metals : open access journal , Vol. 13.2023, No. 2, 346, 2023.

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Bodlos R, Scheiber D, Spitaler J, Romaner L. Modification of the Cu/W interface cohesion by segregation. Metals : open access journal . 2023;13.2023(2):346. doi: 10.3390/met13020346

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Bodlos, Rishi ; Scheiber, Daniel ; Spitaler, Jürgen et al. / Modification of the Cu/W interface cohesion by segregation. In: Metals : open access journal . 2023 ; Vol. 13.2023, No. 2.

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@article{ac66444c911b42228ebb8c1b243dee2e,
title = "Modification of the Cu/W interface cohesion by segregation",
abstract = "Cu/W composites are widely used in various industrial fields as they show thermomechanical properties suitable for a wide range of applications. Additionally, in semiconductor products, WTi in contact with Cu acts as a barrier material between Cu and Si/SiO2. Therefore, the bonding behavior of both Cu/W and Cu/WTi is of great economical interest, also with respect to the effects that impurities could have on the behaviour of the Cu/W(Ti) interface. The segregation behavior of relevant impurities has not been studied in detail before. In this work, we create atomistic models of the Cu/W and Cu/WTi interfaces, compare their energetics to previously known interfaces and study the effect of segregation on the interface cohesion. We find that all investigated segregants, i.e. Ti, Cl, S, Al, H, O, and vacancies weaken the cohesion of the interface.",
author = "Rishi Bodlos and Daniel Scheiber and J{\"u}rgen Spitaler and Lorenz Romaner",
year = "2023",
doi = "10.3390/met13020346",
language = "English",
volume = "13.2023",
journal = "Metals : open access journal ",
issn = "2075-4701",
publisher = "Multidisciplinary Digital Publishing Institute (MDPI)",
number = "2",

}

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TY - JOUR

T1 - Modification of the Cu/W interface cohesion by segregation

AU - Bodlos, Rishi

AU - Scheiber, Daniel

AU - Spitaler, Jürgen

AU - Romaner, Lorenz

PY - 2023

Y1 - 2023

N2 - Cu/W composites are widely used in various industrial fields as they show thermomechanical properties suitable for a wide range of applications. Additionally, in semiconductor products, WTi in contact with Cu acts as a barrier material between Cu and Si/SiO2. Therefore, the bonding behavior of both Cu/W and Cu/WTi is of great economical interest, also with respect to the effects that impurities could have on the behaviour of the Cu/W(Ti) interface. The segregation behavior of relevant impurities has not been studied in detail before. In this work, we create atomistic models of the Cu/W and Cu/WTi interfaces, compare their energetics to previously known interfaces and study the effect of segregation on the interface cohesion. We find that all investigated segregants, i.e. Ti, Cl, S, Al, H, O, and vacancies weaken the cohesion of the interface.

AB - Cu/W composites are widely used in various industrial fields as they show thermomechanical properties suitable for a wide range of applications. Additionally, in semiconductor products, WTi in contact with Cu acts as a barrier material between Cu and Si/SiO2. Therefore, the bonding behavior of both Cu/W and Cu/WTi is of great economical interest, also with respect to the effects that impurities could have on the behaviour of the Cu/W(Ti) interface. The segregation behavior of relevant impurities has not been studied in detail before. In this work, we create atomistic models of the Cu/W and Cu/WTi interfaces, compare their energetics to previously known interfaces and study the effect of segregation on the interface cohesion. We find that all investigated segregants, i.e. Ti, Cl, S, Al, H, O, and vacancies weaken the cohesion of the interface.

U2 - 10.3390/met13020346

DO - 10.3390/met13020346

M3 - Article

VL - 13.2023

JO - Metals : open access journal

JF - Metals : open access journal

SN - 2075-4701

IS - 2

M1 - 346

ER -