High-temperature micromechanical testing of silicon
Research output: Contribution to conference › Poster › Research
Standard
High-temperature micromechanical testing of silicon. / Schaffar, Gerald Josef Kamillo; Tscharnuter, Daniel.
2022. Poster session presented at 4th KAI-Research Project Review, Villach, Austria.
2022. Poster session presented at 4th KAI-Research Project Review, Villach, Austria.
Research output: Contribution to conference › Poster › Research
Harvard
Schaffar, GJK & Tscharnuter, D 2022, 'High-temperature micromechanical testing of silicon', 4th KAI-Research Project Review, Villach, Austria, 13/10/22 - 14/10/22.
APA
Schaffar, G. J. K., & Tscharnuter, D. (2022). High-temperature micromechanical testing of silicon. Poster session presented at 4th KAI-Research Project Review, Villach, Austria.
Vancouver
Schaffar GJK, Tscharnuter D. High-temperature micromechanical testing of silicon. 2022. Poster session presented at 4th KAI-Research Project Review, Villach, Austria.
Author
Bibtex - Download
@conference{ef2857a690844e1b8f8f48d87d0ee201,
title = "High-temperature micromechanical testing of silicon",
author = "Schaffar, {Gerald Josef Kamillo} and Daniel Tscharnuter",
year = "2022",
language = "English",
note = "4th KAI-Research Project Review ; Conference date: 13-10-2022 Through 14-10-2022",
}
RIS (suitable for import to EndNote) - Download
TY - CONF
T1 - High-temperature micromechanical testing of silicon
AU - Schaffar, Gerald Josef Kamillo
AU - Tscharnuter, Daniel
PY - 2022
Y1 - 2022
M3 - Poster
T2 - 4th KAI-Research Project Review
Y2 - 13 October 2022 through 14 October 2022
ER -
